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CMOS VLSI Engineering
Kuo, James B.; Su, Ker-Wei
€ 196.29
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Description for CMOS VLSI Engineering
Paperback. Num Pages: 422 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 244 x 170 x 23. Weight in Grams: 793.
Silicon-On-Insulator (SOI) CMOS technology has been regarded as another major technology for VLSI in addition to bulk CMOS technology. Owing to the buried oxide structure, SOI technology offers superior CMOS devices with higher speed, high density, and reduced second order effects for deep-submicron low-voltage, low-power VLSI circuits applications. In addition to VLSI applications, and because of its outstanding properties, SOI technology has been used to realize communication circuits, microwave devices, BICMOS devices, and even fiber optics applications.
CMOS VLSI Engineering: Silicon-On-Insulator addresses three key factors in engineering SOI ... Read more
Silicon-On-Insulator (SOI) CMOS technology has been regarded as another major technology for VLSI in addition to bulk CMOS technology. Owing to the buried oxide structure, SOI technology offers superior CMOS devices with higher speed, high density, and reduced second order effects for deep-submicron low-voltage, low-power VLSI circuits applications. In addition to VLSI applications, and because of its outstanding properties, SOI technology has been used to realize communication circuits, microwave devices, BICMOS devices, and even fiber optics applications.
CMOS VLSI Engineering: Silicon-On-Insulator addresses three key factors in engineering SOI ... Read more
Product Details
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Number of pages
422
Condition
New
Number of Pages
422
Place of Publication
New York, NY, United States
ISBN
9781441950574
SKU
V9781441950574
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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