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Dry Etching for VLSI
Roosmalen, A. J. Van; Baggerman, J. A. G.; Brader, S. J. H.
€ 184.83
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Description for Dry Etching for VLSI
Paperback. Series: Updates in Applied Physics and Electrical Technology. Num Pages: 254 pages, biography. BIC Classification: PHD; PHM; THR; TJFD. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 13. Weight in Grams: 451.
This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal ... Read more
This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal ... Read more
Product Details
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Number of pages
254
Condition
New
Series
Updates in Applied Physics and Electrical Technology
Number of Pages
237
Place of Publication
New York, United States
ISBN
9781489925688
SKU
V9781489925688
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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