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Electromigration Modeling at Circuit Layout Level
Tan, Cher Ming; He, Feifei
€ 76.43
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Description for Electromigration Modeling at Circuit Layout Level
Paperback. Series: Springerbriefs in Applied Sciences and Technology/Springerbriefs in Reliability. Num Pages: 112 pages, 73 black & white illustrations, 2 colour illustrations, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 6. Weight in Grams: 189.
Product Details
Format
Paperback
Publication date
2013
Publisher
Springer Verlag, Singapore Singapore
Number of pages
112
Condition
New
Series
Springerbriefs in Applied Sciences and Technology/Springerbriefs in Reliability
ISBN
9789814451208
SKU
V9789814451208
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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