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Deng, Yangdong; Maly, Wojciech - 3-dimensional VLSI - 9783642041563 - V9783642041563
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3-dimensional VLSI

€ 179.45
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Description for 3-dimensional VLSI Hardback. 3-Dimensional VLSI presents a new integration scheme designed for problems that are difficult to solve with traditional non-monolithic integration schemes. Major 3-D VLSI design issues are also introduced, within an integrated framework. Num Pages: 200 pages, 50 black & white illustrations, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 243 x 157 x 16. Weight in Grams: 456.

"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.

Dr. Yangdong Deng is an associate professor at the Institute of ... Read more

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Product Details

Format
Hardback
Publication date
2010
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
200
Condition
New
Number of Pages
200
Place of Publication
Berlin, Germany
ISBN
9783642041563
SKU
V9783642041563
Shipping Time
Usually ships in 5 to 9 working days
Ref
99-4

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