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Deng, Yangdong; Maly, Wojciech - 3-dimensional VLSI - 9783642041563 - V9783642041563
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3-dimensional VLSI

€ 183.75
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Description for 3-dimensional VLSI Hardback. 3-Dimensional VLSI presents a new integration scheme designed for problems that are difficult to solve with traditional non-monolithic integration schemes. Major 3-D VLSI design issues are also introduced, within an integrated framework. Num Pages: 200 pages, 50 black & white illustrations, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 243 x 157 x 16. Weight in Grams: 456.

"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.

Dr. Yangdong Deng is an associate professor at the Institute of ... Read more

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Product Details

Format
Hardback
Publication date
2010
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
200
Condition
New
Number of Pages
200
Place of Publication
Berlin, Germany
ISBN
9783642041563
SKU
V9783642041563
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-4

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