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Electronics engineering

Results 501 - 520 of 2007

Electronics engineering

Hardback. Presents a description of power analysis and optimization techniques at the higher (architecture and behavior) levels of the design hierarchy, which are often the levels that yield the most power savings. This book describes power estimation and optimization techniques for use during high-level (behavioral synthesis). Num Pages: 175 pages, biography. BIC Classification: THR; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 254 x 178 x 12. Weight in Grams: 568.
Format
Hardback
Publication date
1997
Publisher
Kluwer Academic Publishers United States
Number of pages
175
Condition
New
SKU
V9780792380733
ISBN
9780792380733
Hardback
Condition: New

€ 128.96

Hardback. This book addresses the steps needed to monitor health assessment systems and the anticipation of their failures: choice and location of sensors, data acquisition and processing, health assessment and prediction of the duration of residual useful life. The digital revolution and mechatronics foreshadowed the advent of the 4. Num Pages: 182 pages, black & white illustrations. BIC Classification: TGM; TGP; TJFM. Category: (P) Professional & Vocational. Dimension: 242 x 165 x 15. Weight in Grams: 432.
Format
Hardback
Publication date
2016
Publisher
ISTE Ltd and John Wiley & Sons Inc United Kingdom
Number of pages
182
Condition
New
Edition
1st Edition
SKU
V9781848219373
ISBN
9781848219373
Hardback
Condition: New

€ 177.60

Paperback. .
Publisher
now publishers Inc United States
Number of pages
104
Format
Paperback
Publication date
2008
Condition
New
SKU
V9781601981929
ISBN
9781601981929
Paperback
Condition: New

€ 87.05

Hardback. Presents the basis for reusing the test vector generation and simulation for the purpose of implementation verification, to result in a significant timesaving. This book brings the results in the direction of merging manufacturing test vector generation and verification. Series: Frontiers in Electronic Testing. Num Pages: 231 pages, biography. BIC Classification: TJFM1. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 14. Weight in Grams: 509.
Format
Hardback
Publication date
2003
Publisher
Kluwer Academic Publishers United States
Number of pages
231
Condition
New
SKU
V9781402076527
ISBN
9781402076527
Hardback
Condition: New

€ 127.48

Hardback. Oversampling techniques based on sigma-delta modulation are used to implement the analog/digital interfaces in CMOS VLSI technologies. This book provides an analysis of power dissipation in sigma-delta modulators, and describes a low-voltage implementation of a digital-audio performance A/D converter based on the results of this analysis. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 187 pages, biography. BIC Classification: TJF; TJKR. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 12. Weight in Grams: 476.
Format
Hardback
Publication date
1998
Publisher
Kluwer Academic Publishers United States
Number of pages
187
Condition
New
SKU
V9780792383611
ISBN
9780792383611
Hardback
Condition: New

€ 191.16

Hardcover. Editor(s): Abd-Alhameed, R A. Num Pages: 186 pages. BIC Classification: PHK; TJF. Category: (P) Professional & Vocational. Dimension: 230 x 153 x 21. Weight in Grams: 582.
Format
Hardback
Publication date
2014
Publisher
Nova Science Pub Inc
Condition
New
SKU
V9781611220131
ISBN
9781611220131
Hardback
Condition: New

€ 253.11
€ 170.94

Hardback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 244 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 15. Weight in Grams: 553.
Format
Hardback
Publication date
1986
Publisher
Kluwer Academic Publishers United States
Number of pages
244
Condition
New
SKU
V9780898382150
ISBN
9780898382150
Hardback
Condition: New

€ 128.27

Hardcover.
Format
Hardback
Publication date
1979
Publisher
James Clarke & Co Ltd United Kingdom
Number of pages
136
Condition
New
SKU
V9780718823436
ISBN
9780718823436
Hardback
Condition: New

€ 30.86

Hardback. The integration of silicon sensors with signal processing circuitry on a single chip is seen as a major concern, as it offers the potential for significant improvements technically and economically. This text looks at silicon sensors and their circuits. Editor(s): Wolfenbuttel, R.F. Series: Sensor physics & techniques series. Num Pages: 330 pages, biography. BIC Classification: TJFC; TTBL. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 216 x 140 x 22. Weight in Grams: 570.
Format
Hardback
Publication date
1995
Publisher
Chapman and Hall United Kingdom
Number of pages
330
Condition
New
SKU
V9780412709708
ISBN
9780412709708
Hardback
Condition: New

€ 243.33

Hardcover. Provides microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Offering a balance of theory and practical applications, this three volume set features step-by-step examples and technical data, simplifying each phase of package design and production. Num Pages: 720 pages, biography. BIC Classification: TJFD5; UM. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 39. Weight in Grams: 1386.
Publisher
Springer
Format
Hardback
Publication date
1997
Edition
2nd
Condition
New
SKU
V9780412084317
ISBN
9780412084317
Hardback
Condition: New

€ 246.66

Hardcover. Presents the proceedings of an international conference organized by Loughborough University. This work is suitable for those involved in this field and for those who wish to be informed of the developments and advances. Editor(s): Parkin, R.M; El-Habaibeh, A.; Jackson, M. R. Num Pages: 670 pages, illustrations. BIC Classification: TG; TJFM. Category: (P) Professional & Vocational. Dimension: 241 x 166 x 46. Weight in Grams: 1632.
Format
Hardback
Publication date
2003
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
1st Edition
Number of pages
670
Condition
New
SKU
V9781860584206
ISBN
9781860584206
Hardback
Condition: New

€ 631.20

Paperback. A book of problems with worked solutions, which aims to provide practice in problem-solving for students on undergraduate and Higher National Diploma programmes in electronics. It may used as an independent text, or as a companion text to "Electronics" by Crecraft, Gorham and Sparkes. Num Pages: 264 pages, biography. BIC Classification: TJFC. Category: (UF) Further/Higher Education; (UU) Undergraduate. Dimension: 246 x 189 x 14. Weight in Grams: 478.
Format
Paperback
Publication date
1994
Publisher
Chapman and Hall United Kingdom
Number of pages
264
Condition
New
SKU
V9780412578205
ISBN
9780412578205
Paperback
Condition: New

€ 127.25

Hardcover. Magnetic recording technology has very wide applications in numerous industries. Prominent among these are applications in the computer and recording industries. Beginning with the fundamentals of magnetism, this book discusses all aspects of magnetic recording. Num Pages: 488 pages, illustrations. BIC Classification: TJFD; TJK. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 238 x 165 x 34. Weight in Grams: 886.
Format
Hardback
Publication date
1999
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
488
Condition
New
SKU
V9780471317142
ISBN
9780471317142
Hardback
Condition: New

€ 240.38

Hardcover. An advanced guide to mixed-signal circuit design that will bring designers rapidly up to speed. This new edition features additional examples and more, smaller chapters to make the information more accessible. The book is supported by an author maintained web-site that provides solutions to the homework problems, net lists, and simulations. . Series: IEEE Press Series on Microelectronic Systems. Num Pages: 352 pages, , black & white tables, figures, charts, graphs. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 239 x 160 x 22. Weight in Grams: 630.
Format
Hardback
Publication date
2008
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
2nd Edition
Number of pages
352
Condition
New
SKU
V9780470290262
ISBN
9780470290262
Hardback
Condition: New

€ 168.81

Hardback. Num Pages: 176 pages. BIC Classification: TBN; TGB; TGMF; TJFN. Category: (P) Professional & Vocational. Dimension: 241 x 163 x 13. Weight in Grams: 436.
Format
Hardback
Publication date
2015
Publisher
John Wiley & Sons Inc United States
Number of pages
176
Condition
New
SKU
V9781119117605
ISBN
9781119117605
Hardback
Condition: New

€ 190.64

Paperback. Proceedings of the NATO Advanced Study Institute, Il Ciocco, Castelvecchio Pascoli, Italy, June 30-July 11, 1986 Editor(s): Levy, R. A. Series: NATO Science Series E:. Num Pages: 1000 pages, biography. BIC Classification: TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 49. Weight in Grams: 1502.
Publisher
Springer
Format
Paperback
Publication date
1989
Edition
Softcover reprint of the original 1st ed. 1989
Condition
New
SKU
V9780792301547
ISBN
9780792301547
Paperback
Condition: New

€ 599.37

Hardcover. Organic semiconductors are attracting tremendous attention since they are cheap, easy to process, and capable of being deposited on flexible substrates and bent, while their inorganic competitors, e.g. crystalline silicon, would crack. Num Pages: 304 pages, Illustrations (some col.). BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 238 x 170 x 22. Weight in Grams: 630.
Format
Hardback
Publication date
2011
Publisher
John Wiley & Sons Inc United Kingdom
Edition
1st Edition
Number of pages
304
Condition
New
SKU
V9780470559734
ISBN
9780470559734
Hardback
Condition: New

€ 146.22

Hardback. Num Pages: 470 pages, 10 black & white illustrations, 10 colour illustrations, 10 colour tables, biography. BIC Classification: TJFM; TRP. Category: (P) Professional & Vocational. Dimension: 254 x 178. .
Publisher
Springer Verlag, Singapore
Format
Hardback
Publication date
2017
Edition
1st ed. 2017
Condition
New
SKU
V9789811033810
ISBN
9789811033810
Hardback
Condition: New

€ 147.57

Hardcover. Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field. Series: ECS Series of Texts and Monographs. Num Pages: 320 pages, illustrations. BIC Classification: PHFC; PNRH; TGMT; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 243 x 165 x 23. Weight in Grams: 598.
Format
Hardback
Publication date
1998
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
320
Condition
New
SKU
V9780471574811
ISBN
9780471574811
Hardback
Condition: New

€ 232.84

Paperback. Num Pages: 273 pages, biography. BIC Classification: TJFM; UM. Category: (G) General (US: Trade). Dimension: 254 x 178 x 13. Weight in Grams: 458. 258 pages, black & white illustrations. Cateogry: (G) General (US: Trade). BIC Classification: TJFM; UM. Dimension: 235 x 195 x 15. Weight: 458.
Format
Paperback
Publication date
2011
Publisher
Apress
Edition
1st Edition
Number of pages
258
Condition
New
SKU
V9781430236238
ISBN
9781430236238
Paperback
Condition: New

€ 40.99
€ 33.85

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