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Electronics engineering

Results 1481 - 1500 of 2002

Electronics engineering

Hardcover. Num Pages: 448 pages. BIC Classification: TJFD. Category: (P) Professional & Vocational. Weight in Grams: 666.
Format
Hardback
Publication date
2016
Publisher
John Wiley & Sons Inc
Edition
1st Edition
Condition
New
SKU
V9781119155492
ISBN
9781119155492
Hardback
Condition: New

€ 147.48

Hardback. This authoritative resource presents current practices for the design of RF and microwave filters. This one-stop reference provides readers with essential and practical information in order to design their own filter design software package, ultimately saving time and money. Num Pages: 412 pages, illustrations. BIC Classification: TJFN. Category: (P) Professional & Vocational. Dimension: 269 x 282 x 33. Weight in Grams: 1124.
Publisher
Artech House Publishers
Format
Hardback
Publication date
2016
Condition
New
SKU
V9781630811570
ISBN
9781630811570
Hardback
Condition: New

€ 148.54
€ 132.47

Hardback. .
Publisher
Artech House Publishers
Format
Hardback
Publication date
2015
Edition
1st Edition
Condition
New
SKU
V9781608078066
ISBN
9781608078066
Hardback
Condition: New

€ 169.93
€ 59.48

Hardcover. Num Pages: 300 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational. Weight in Grams: 666.
Publisher
John Wiley & Sons Inc
Format
Hardback
Publication date
2017
Edition
1st Edition
Condition
New
SKU
V9781119206774
ISBN
9781119206774
Hardback
Condition: New

€ 131.57

Paperback. .
Publisher
Morgan & Claypool Publishers United States
Number of pages
149
Format
Paperback
Publication date
2017
Condition
New
SKU
V9781627059138
ISBN
9781627059138
Paperback
Condition: New

€ 88.44

Paperback. Num Pages: 273 pages, biography. BIC Classification: TJFM; UM. Category: (G) General (US: Trade). Dimension: 254 x 178 x 13. Weight in Grams: 458. 258 pages, black & white illustrations. Cateogry: (G) General (US: Trade). BIC Classification: TJFM; UM. Dimension: 235 x 195 x 15. Weight: 458.
Format
Paperback
Publication date
2011
Publisher
Apress
Edition
1st Edition
Number of pages
258
Condition
New
SKU
V9781430236238
ISBN
9781430236238
Paperback
Condition: New

€ 40.99
€ 33.85

Hardcover. Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field. Series: ECS Series of Texts and Monographs. Num Pages: 320 pages, illustrations. BIC Classification: PHFC; PNRH; TGMT; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 243 x 165 x 23. Weight in Grams: 598.
Format
Hardback
Publication date
1998
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
320
Condition
New
SKU
V9780471574811
ISBN
9780471574811
Hardback
Condition: New

€ 232.84

Hardback. Num Pages: 470 pages, 10 black & white illustrations, 10 colour illustrations, 10 colour tables, biography. BIC Classification: TJFM; TRP. Category: (P) Professional & Vocational. Dimension: 254 x 178. .
Publisher
Springer Verlag, Singapore
Format
Hardback
Publication date
2017
Edition
1st ed. 2017
Condition
New
SKU
V9789811033810
ISBN
9789811033810
Hardback
Condition: New

€ 147.57

Hardcover. Organic semiconductors are attracting tremendous attention since they are cheap, easy to process, and capable of being deposited on flexible substrates and bent, while their inorganic competitors, e.g. crystalline silicon, would crack. Num Pages: 304 pages, Illustrations (some col.). BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 238 x 170 x 22. Weight in Grams: 630.
Format
Hardback
Publication date
2011
Publisher
John Wiley & Sons Inc United Kingdom
Edition
1st Edition
Number of pages
304
Condition
New
SKU
V9780470559734
ISBN
9780470559734
Hardback
Condition: New

€ 146.22

Paperback. Proceedings of the NATO Advanced Study Institute, Il Ciocco, Castelvecchio Pascoli, Italy, June 30-July 11, 1986 Editor(s): Levy, R. A. Series: NATO Science Series E:. Num Pages: 1000 pages, biography. BIC Classification: TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 49. Weight in Grams: 1502.
Publisher
Springer
Format
Paperback
Publication date
1989
Edition
Softcover reprint of the original 1st ed. 1989
Condition
New
SKU
V9780792301547
ISBN
9780792301547
Paperback
Condition: New

€ 599.37

Hardback. Num Pages: 176 pages. BIC Classification: TBN; TGB; TGMF; TJFN. Category: (P) Professional & Vocational. Dimension: 241 x 163 x 13. Weight in Grams: 436.
Format
Hardback
Publication date
2015
Publisher
John Wiley & Sons Inc United States
Number of pages
176
Condition
New
SKU
V9781119117605
ISBN
9781119117605
Hardback
Condition: New

€ 190.64

Hardcover. An advanced guide to mixed-signal circuit design that will bring designers rapidly up to speed. This new edition features additional examples and more, smaller chapters to make the information more accessible. The book is supported by an author maintained web-site that provides solutions to the homework problems, net lists, and simulations. . Series: IEEE Press Series on Microelectronic Systems. Num Pages: 352 pages, , black & white tables, figures, charts, graphs. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 239 x 160 x 22. Weight in Grams: 630.
Format
Hardback
Publication date
2008
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
2nd Edition
Number of pages
352
Condition
New
SKU
V9780470290262
ISBN
9780470290262
Hardback
Condition: New

€ 168.81

Hardcover. Magnetic recording technology has very wide applications in numerous industries. Prominent among these are applications in the computer and recording industries. Beginning with the fundamentals of magnetism, this book discusses all aspects of magnetic recording. Num Pages: 488 pages, illustrations. BIC Classification: TJFD; TJK. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 238 x 165 x 34. Weight in Grams: 886.
Format
Hardback
Publication date
1999
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
488
Condition
New
SKU
V9780471317142
ISBN
9780471317142
Hardback
Condition: New

€ 240.38

Paperback. A book of problems with worked solutions, which aims to provide practice in problem-solving for students on undergraduate and Higher National Diploma programmes in electronics. It may used as an independent text, or as a companion text to "Electronics" by Crecraft, Gorham and Sparkes. Num Pages: 264 pages, biography. BIC Classification: TJFC. Category: (UF) Further/Higher Education; (UU) Undergraduate. Dimension: 246 x 189 x 14. Weight in Grams: 478.
Format
Paperback
Publication date
1994
Publisher
Chapman and Hall United Kingdom
Number of pages
264
Condition
New
SKU
V9780412578205
ISBN
9780412578205
Paperback
Condition: New

€ 127.25

Hardcover. Presents the proceedings of an international conference organized by Loughborough University. This work is suitable for those involved in this field and for those who wish to be informed of the developments and advances. Editor(s): Parkin, R.M; El-Habaibeh, A.; Jackson, M. R. Num Pages: 670 pages, illustrations. BIC Classification: TG; TJFM. Category: (P) Professional & Vocational. Dimension: 241 x 166 x 46. Weight in Grams: 1632.
Format
Hardback
Publication date
2003
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
1st Edition
Number of pages
670
Condition
New
SKU
V9781860584206
ISBN
9781860584206
Hardback
Condition: New

€ 631.20

Hardcover. Provides microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Offering a balance of theory and practical applications, this three volume set features step-by-step examples and technical data, simplifying each phase of package design and production. Num Pages: 720 pages, biography. BIC Classification: TJFD5; UM. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 39. Weight in Grams: 1386.
Publisher
Springer
Format
Hardback
Publication date
1997
Edition
2nd
Condition
New
SKU
V9780412084317
ISBN
9780412084317
Hardback
Condition: New

€ 246.66

Hardback. The integration of silicon sensors with signal processing circuitry on a single chip is seen as a major concern, as it offers the potential for significant improvements technically and economically. This text looks at silicon sensors and their circuits. Editor(s): Wolfenbuttel, R.F. Series: Sensor physics & techniques series. Num Pages: 330 pages, biography. BIC Classification: TJFC; TTBL. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 216 x 140 x 22. Weight in Grams: 570.
Format
Hardback
Publication date
1995
Publisher
Chapman and Hall United Kingdom
Number of pages
330
Condition
New
SKU
V9780412709708
ISBN
9780412709708
Hardback
Condition: New

€ 243.33

Hardcover.
Format
Hardback
Publication date
1979
Publisher
James Clarke & Co Ltd United Kingdom
Number of pages
136
Condition
New
SKU
V9780718823436
ISBN
9780718823436
Hardback
Condition: New

€ 30.86

Hardback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 244 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 15. Weight in Grams: 553.
Format
Hardback
Publication date
1986
Publisher
Kluwer Academic Publishers United States
Number of pages
244
Condition
New
SKU
V9780898382150
ISBN
9780898382150
Hardback
Condition: New

€ 128.27

Hardcover. Editor(s): Abd-Alhameed, R A. Num Pages: 186 pages. BIC Classification: PHK; TJF. Category: (P) Professional & Vocational. Dimension: 230 x 153 x 21. Weight in Grams: 582.
Format
Hardback
Publication date
2014
Publisher
Nova Science Pub Inc
Condition
New
SKU
V9781611220131
ISBN
9781611220131
Hardback
Condition: New

€ 253.11
€ 170.94

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