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Electronics engineering

Results 301 - 320 of 1997

Electronics engineering

Hardback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 173 pages, biography. BIC Classification: TJFM1. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 12. Weight in Grams: 444.
Format
Hardback
Publication date
1991
Publisher
Kluwer Academic Publishers United States
Number of pages
173
Condition
New
SKU
V9780792391333
ISBN
9780792391333
Hardback
Condition: New

€ 190.72

Hardcover. Numerical solutions of electromagnetic field problems is an area of paramount interest in academia, industry and government. This book provides a compendium of solution techniques dealing with integral equations arising in electromagnetic field problems in time and frequency domains. Series: Wiley Series in Microwave and Optical Engineering. Num Pages: 482 pages, Illustrations (some col). BIC Classification: PHK; TJF. Category: (P) Professional & Vocational. Dimension: 243 x 164 x 30. Weight in Grams: 852.
Format
Hardback
Publication date
2010
Publisher
John Wiley & Sons Inc United Kingdom
Edition
1st Edition
Number of pages
482
Condition
New
SKU
V9780470487679
ISBN
9780470487679
Hardback
Condition: New

€ 123.95

paperback. This work describes the devices used in microelectronics production and power transmission equipment, and in very high-power motor control such as electric trains and steel-mills. It discusses advanced concepts enabling improved power thyristor performance. Num Pages: 584 pages, 17 black & white tables, biography. BIC Classification: PNFS; THRD; TJF; TJFC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 30. Weight in Grams: 884.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Edition
2012th Edition
Number of pages
584
Condition
New
SKU
V9781493901326
ISBN
9781493901326
Paperback
Condition: New

€ 240.95

Hardcover. Num Pages: Illustrations (some col.). BIC Classification: PN; TDCK; TJFD5. Category: (P) Professional & Vocational. Dimension: 268 x 184 x 20. Weight in Grams: 670.
Format
Hardback
Publication date
2006
Publisher
Nova Science Publishers Inc United States
Number of pages
226
Condition
New
SKU
V9781594545177
ISBN
9781594545177
Hardback
Condition: New

€ 274.56
€ 185.04

Hardback. The drive toward new semiconductor technologies is intricately related to market demands for cheaper, smaller, faster and more reliable circuits with lower power consumption. This work presents to engineers and scientists those parts of modern processing technologies that are of importance to the design and manufacture of semiconductor circuits. Num Pages: 602 pages, biography. BIC Classification: TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 33. Weight in Grams: 1039.
Format
Hardback
Publication date
1994
Publisher
Kluwer Academic Publishers United States
Number of pages
602
Condition
New
SKU
V9780792395348
ISBN
9780792395348
Hardback
Condition: New

€ 276.14

hardcover. Microwave solid state circuits are characterised by being etched on a suitable dielectric substrate. They are generically referred to as Microwave Integrated Circuits (MIC). This contributed volume presents a comprehensive discussion of the design of passive circuits, solid state devices, and microwave solid state circuits. Num Pages: 920 pages, illustrations. BIC Classification: TJFN. Category: (P) Professional & Vocational. Dimension: 237 x 165 x 50. Weight in Grams: 1276.
Format
Hardback
Publication date
2003
Publisher
John Wiley and Sons Ltd United States
Edition
2nd Edition
Number of pages
920
Condition
New
SKU
V9780471207559
ISBN
9780471207559
Hardback
Condition: New

€ 297.97

Hardback. Describes the design and theory of high-accuracy smart temperature sensors in CMOS technology. The authors provide the reader with an overview of dynamic offset-cancellation techniques and CMOS bandgap references, which are the basic techniques and building blocks that determine the overall accuracy of CMOS smart temperature sensors. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 121 pages, biography. BIC Classification: TDPB; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 9. Weight in Grams: 371.
Format
Hardback
Publication date
2000
Publisher
Kluwer Academic Publishers United States
Number of pages
121
Condition
New
SKU
V9780792372172
ISBN
9780792372172
Hardback
Condition: New

€ 189.71

Hardcover. The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Editor(s): Baklanov, Mikhail R.; Maex, Karen; Green, Martin. Series: Wiley Series in Materials for Electronic & Optoelectronic Applications. Num Pages: 508 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 249 x 177 x 34. Weight in Grams: 1102.
Format
Hardback
Publication date
2007
Publisher
John Wiley & Sons Inc United Kingdom
Edition
1st Edition
Number of pages
508
Condition
New
SKU
V9780470013601
ISBN
9780470013601
Hardback
Condition: New

€ 282.56

Hardback. Proceedings of the NATO Advanced Study Institute, held in Erice, Sicily, Italy, 15-30 June 2001 Editor(s): Di Bartolo, Baldassare. Series: NATO Science Series II. Num Pages: 727 pages, biography. BIC Classification: TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 41. Weight in Grams: 1249.
Format
Hardback
Publication date
2003
Publisher
Kluwer Academic Publishers United States
Number of pages
727
Condition
New
SKU
V9781402011030
ISBN
9781402011030
Hardback
Condition: New

€ 245.59

Paperback. Proceedings of the NATO Advanced Study Institute, held in Erice, Sicily, Italy, 15-30 June 2001 Editor(s): Di Bartolo, Baldassare. Series: NATO Science Series II. Num Pages: 727 pages, biography. BIC Classification: TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 240 x 160 x 39. Weight in Grams: 1208.
Format
Paperback
Publication date
2003
Publisher
Kluwer Academic Publishers United States
Edition
Softcover reprint of the original 1st ed. 2002
Number of pages
727
Condition
New
SKU
V9781402011221
ISBN
9781402011221
Paperback
Condition: New

€ 245.24

Hardcover. The current semiconductor model continues to give birth to a large number of design engineers who are producing a large number of chips, but without any interaction with process/device people. This book addresses major challenges faced by engineers and offers concrete solutions provided by industry experts. Num Pages: 386 pages, Illustrations. BIC Classification: TG; TJFD. Category: (P) Professional & Vocational. Dimension: 232 x 164 x 22. Weight in Grams: 688.
Format
Hardback
Publication date
2008
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
1st Edition
Number of pages
386
Condition
New
SKU
V9780470112809
ISBN
9780470112809
Hardback
Condition: New

€ 149.99

Hardback. BIC Classification: TJFC. Dimension: 235 x 155. .
Format
Hardback
Publication date
2016
Publisher
Springer International Publishing AG
Edition
1st ed. 2016
Condition
New
SKU
V9783319279190
ISBN
9783319279190
Hardback
Condition: New

€ 124.58

Hardcover. Num Pages: 368 pages. BIC Classification: TJFM. Category: (P) Professional & Vocational. Dimension: 178 x 252 x 22. Weight in Grams: 702.
Publisher
John Wiley & Sons Inc
Format
Hardback
Publication date
2016
Edition
1st Edition
Condition
New
SKU
V9781119239925
ISBN
9781119239925
Hardback
Condition: New

€ 147.42

Hardback. This fascinating book discusses the emergence of humanlike robots into our everyday world. It covers the trends, possibilities, and concerns we will all feel with their emergence. State-of-the-art photos and futuristic illustrations are included. Num Pages: 173 pages, 4 black & white tables, biography. BIC Classification: PDR; PDZ; TJFM; TTDS; UYQ. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 13. Weight in Grams: 458.
Format
Hardback
Publication date
2008
Publisher
Springer-Verlag New York Inc. United States
Number of pages
173
Condition
New
SKU
V9780387853482
ISBN
9780387853482
Hardback
Condition: New

€ 40.99
€ 33.95

Paperback. Folding networks, a generalization of recurrent neural networks to tree structured inputs, are investigated as a mechanism to learn regularities on classical symbolic data. Also, the architecture, the training mechanism, and several applications in different areas are explained in this work. Series: Lecture Notes in Control and Information Sciences. Num Pages: 150 pages, biography. BIC Classification: TJFM; UYQN. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 8. Weight in Grams: 530.
Format
Paperback
Publication date
2000
Publisher
Springer London Ltd United Kingdom
Number of pages
150
Condition
New
SKU
V9781852333430
ISBN
9781852333430
Paperback
Condition: New

€ 64.55

Hardback. Series: Studies in Systems, Decision and Control. Num Pages: 294 pages, 205 colour illustrations, biography. BIC Classification: PBWH; TJFC; TJFM. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 18. Weight in Grams: 608.
Format
Hardback
Publication date
2015
Publisher
Springer International Publishing AG Switzerland
Number of pages
294
Condition
New
SKU
V9783319242002
ISBN
9783319242002
Hardback
Condition: New

€ 122.98

Hardcover. High-power microwave (HPM) technology surrounds us with its applications in communications and power delivery. This title presents the history, state of the art, and possible future of high power microwave (HPM) source research and technologies in one book. Editor(s): Barker, Robert J.; Schamiloglu, Edl. Num Pages: 528 pages, Illustrations. BIC Classification: TJFM; TJFN. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 264 x 187 x 40. Weight in Grams: 1120.
Format
Hardback
Publication date
2001
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
528
Condition
New
SKU
V9780780360068
ISBN
9780780360068
Hardback
Condition: New

€ 252.94

Hardback. A discussion of the major components of a CAD Framework and their relationships to one another. Each area is presented in detail and a brief review of the state-of-the-art and current directions for research is presented. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 195 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 14. Weight in Grams: 488.
Format
Hardback
Publication date
1992
Publisher
Kluwer Academic Publishers United States
Number of pages
195
Condition
New
SKU
V9780792392521
ISBN
9780792392521
Hardback
Condition: New

€ 127.37

Hardcover.
Format
Hardback
Publication date
2003
Publisher
Nova Science Publishers Inc United States
Number of pages
224
Condition
New
SKU
V9781590338650
ISBN
9781590338650
Hardback
Condition: New

€ 153.32
€ 114.93

Hardcover. Editor(s): Martins, Barry P. Num Pages: 244 pages, tables & charts. BIC Classification: PHK; TJFD5. Category: (G) General (US: Trade). Dimension: 258 x 185 x 27. Weight in Grams: 792.
Format
Hardback
Publication date
2004
Publisher
Nova Science Publishers Inc United States
Number of pages
244
Condition
New
SKU
V9781594540059
ISBN
9781594540059
Hardback
Condition: New

€ 190.17
€ 129.19

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