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Electronics engineering

Results 7701 - 7720 of 8451

Electronics engineering

Hardback. Providing a thorough overview of leading research from internationally-recognized contributing authors, this book describes methods for the preparation and application of redox systems for organic electronic materials like transistors, photovoltaics, and batteries. Num Pages: 608 pages. BIC Classification: PNN; TJF. Category: (P) Professional & Vocational. Dimension: 250 x 150 x 15. Weight in Grams: 666.
Format
Hardback
Publication date
2016
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
608
Condition
New
SKU
V9781118858745
ISBN
9781118858745
Hardback
Condition: New

€ 212.30

Paperback. Processes which are heavily non-linear or complex pose difficult problems for automatic control systems, yet can often be handled easily by human operators. This volume reviews a decade of research into control systems and artificial intelligence designed to imitate human behaviour. Series: Lecture Notes in Control and Information Sciences. Num Pages: 224 pages, 16 black & white tables, biography. BIC Classification: 3JJPN; 3JJPR; TJFM; UYQ. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 244 x 170 x 12. Weight in Grams: 401.
Format
Paperback
Publication date
1992
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
224
Condition
New
SKU
V9783540550570
ISBN
9783540550570
Paperback
Condition: New

€ 62.40

Hardback. Introduces the fundamentals along with topics ranging from quantum nanocircuits and the potential applications of self-formed quantum dot structures, through the use of MOVPE to produce quantum structured semiconductors, lithography and patterning and the structural characterization of self-organized Ge-islands. Editor(s): Pearsall, Tom. Series: Electronic Materials Series. Num Pages: 273 pages, 77 black & white illustrations, biography. BIC Classification: TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 17. Weight in Grams: 576.
Format
Hardback
Publication date
2000
Publisher
Kluwer Academic Publishers United States
Number of pages
273
Condition
New
SKU
V9780792377481
ISBN
9780792377481
Hardback
Condition: New

€ 124.16

Paperback. .
Publisher
Taylor & Francis Ltd
Format
Paperback
Publication date
2017
Edition
5th Edition
Condition
New
SKU
V9780415725774
ISBN
9780415725774
Paperback
Condition: New

€ 60.78

Paperback. The workbenches of hobbyists, hackers, and makers have become overrun with microcontrollers, computers-on-a-chip that power homebrewed video games, robots, toys, and more. In Making Things Talk, Tom Igoe, one of the creators of Arduino, shows how to make these gadgets talk. Num Pages: 496 pages. BIC Classification: TJFM; UM. Category: (XV) Technical / Manuals. Dimension: 250 x 150 x 15. Weight in Grams: 666.
Publisher
O´Reilly Media, Inc, USA
Format
Paperback
Publication date
2017
Edition
3rd Edition
Condition
New
SKU
V9781680452150
ISBN
9781680452150
Paperback
Condition: New

€ 42.99
€ 29.98

Paperback. Num Pages: 330 pages, biography. BIC Classification: TJF; UYS. Category: (P) Professional & Vocational. Dimension: 279 x 210 x 18. Weight in Grams: 877.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
2nd ed. Softcover of orig. ed. 1995
Number of pages
330
Condition
New
SKU
V9781441947413
ISBN
9781441947413
Paperback
Condition: New

€ 122.08

Hardback. This volume offers a new approach to teaching the fundamentals of semiconductor components based on the use of the accompanying process and device simulation software. Users are encouraged to augment their understanding by undertaking simulations and creating their own devices. Num Pages: 346 pages, Illustrations. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 250 x 174 x 25. Weight in Grams: 744.
Format
Hardback
Publication date
1999
Publisher
John Wiley & Sons Inc United Kingdom
Edition
1st Edition
Number of pages
346
Condition
New
SKU
V9780471988540
ISBN
9780471988540
Hardback
Condition: New

€ 161.34

Paperback. A new technique for analysing and controlling nonlinear systems is introduced in this book. Although the methods outlined are novel, they can be simply implemented using pre-existing and widely known classical control ideas. Series: Lecture Notes in Control and Information Sciences. Num Pages: 312 pages, biography. BIC Classification: GPFC; PBU; PHS; TJFM. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 16. Weight in Grams: 980.
Format
Paperback
Publication date
2010
Publisher
Springer London Ltd United Kingdom
Number of pages
312
Condition
New
SKU
V9781849961004
ISBN
9781849961004
Paperback
Condition: New

€ 183.65

Paperback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 173 pages, biography. BIC Classification: THR; TJFM; UYQ; UYQV. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 10. Weight in Grams: 296.
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1990
Number of pages
173
Condition
New
SKU
V9781461288329
ISBN
9781461288329
Paperback
Condition: New

€ 118.15

paperback. This book presents cutting edge material science research from the Research Center of Advanced Structural and Functional Materials Design in Japan's Osaka University, especially the fusion of structural and functional materials such as medical bone materials. Editor(s): Kakeshita, Tomoyuki. Num Pages: 300 pages, biography. BIC Classification: TGM; TGMT; TJFD. Category: (G) General (US: Trade). Dimension: 235 x 155 x 16. Weight in Grams: 462.
Format
Paperback
Publication date
2014
Publisher
Springer Verlag, Japan Japan
Edition
2013th Edition
Number of pages
300
Condition
New
SKU
V9784431547471
ISBN
9784431547471
Paperback
Condition: New

€ 118.93

Hardback. This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more. Series: Springer Series in Advanced Microelectronics. Num Pages: 640 pages, 26 black & white tables, biography. BIC Classification: TGMB; TJFC; TJFD. Category: (P) Professional & Vocational. Dimension: 242 x 159 x 53. Weight in Grams: 1102.
Format
Hardback
Publication date
2011
Publisher
Springer-Verlag New York Inc. United States
Number of pages
640
Condition
New
SKU
V9781441977588
ISBN
9781441977588
Hardback
Condition: New

€ 298.13

paperback. This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more. Series: Springer Series in Advanced Microelectronics. Num Pages: 640 pages, 26 black & white tables, biography. BIC Classification: TGMB; TJF; TJFC; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 33. Weight in Grams: 967.
Format
Paperback
Publication date
2013
Publisher
Springer United States
Edition
2011th Edition
Number of pages
640
Condition
New
SKU
V9781461427926
ISBN
9781461427926
Paperback
Condition: New

€ 298.45

Paperback. Series: Communications and Control Engineering. Num Pages: 374 pages, biography. BIC Classification: THR; TJFM; TJFM1. Category: (P) Professional & Vocational. Dimension: 158 x 236 x 29. Weight in Grams: 598.
Publisher
Springer London Ltd
Format
Paperback
Publication date
2011
Edition
Softcover reprint of the original 1st ed. 1995
Condition
New
SKU
V9781447130390
ISBN
9781447130390
Paperback
Condition: New

€ 140.60

Paperback. Num Pages: 355 pages, biography. BIC Classification: TJFM; UM. Category: (G) General (US: Trade). Dimension: 233 x 190 x 18. Weight in Grams: 584. 314 pages, black & white illustrations. Cateogry: (G) General (US: Trade). BIC Classification: TJFM; UM. Dimension: 233 x 190 x 18. Weight: 584.
Format
Paperback
Publication date
2012
Publisher
Apress
Edition
1st Edition
Number of pages
314
Condition
New
SKU
V9781430243595
ISBN
9781430243595
Paperback
Condition: New

€ 45.99
€ 38.29

Hardback. This book examines orientation effects and anisotropy in piezo-active composites. It provides smart-materials applications and reveals the interconnections between microgeometry, electromechanical properties and their anisotropy in composites. Series: Springer Series in Materials Science. Num Pages: 184 pages, 17 black & white illustrations, 31 colour illustrations, biography. BIC Classification: PHV; PNR; TGMB; TGMT; TJF; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 18. Weight in Grams: 450.
Format
Hardback
Publication date
2013
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
184
Condition
New
SKU
V9783642383533
ISBN
9783642383533
Hardback
Condition: New

€ 118.14

Paperback. This book examines orientation effects and anisotropy in piezo-active composites. It provides smart-materials applications and reveals the interconnections between microgeometry, electromechanical properties and their anisotropy in composites. Series: Springer Series in Materials Science. Num Pages: 184 pages, 17 black & white illustrations, 31 colour illustrations, biography. BIC Classification: PHV; PNR; TGMB; TGMT; TJF; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 10. Weight in Grams: 297.
Format
Paperback
Publication date
2016
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Edition
Softcover reprint of the original 1st ed. 2014
Number of pages
184
Condition
New
SKU
V9783662509562
ISBN
9783662509562
Paperback
Condition: New

€ 118.13

Hardcover. An introduction to SPICE-oriented semiconductor device modeling. The SPICE program allows engineers to simulate both individual devices and electronic circuits, performing a large number of different analyses needed for tasks such as verification of circuit designs and prediction of circuit performance. Num Pages: 424 pages, Illustrations. BIC Classification: PHFC; THRD; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 238 x 165 x 29. Weight in Grams: 794.
Format
Hardback
Publication date
1997
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
424
Condition
New
SKU
V9780471157786
ISBN
9780471157786
Hardback
Condition: New

€ 196.20

Hardcover. Together with the internet site, this book is suitable for independent and remote study. The Web site is kept to date and guest educational institutions are invited to join in creating their own lab modules on different device aspects. Num Pages: 256 pages, index. BIC Classification: TJF; UDB. Category: (P) Professional & Vocational. Dimension: 236 x 161 x 17. Weight in Grams: 484.
Format
Hardback
Publication date
2003
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
256
Condition
New
SKU
V9780471413752
ISBN
9780471413752
Hardback
Condition: New

€ 170.21

Hardback. The term neuromorphic expresses relations to computational models found in biological neural systems, which are used as inspiration for building large electronic systems in silicon. This title views developments within neuromorphic engineering from different perspectives. It provides neuromorphic systems descriptions with foundations in silicon. Editor(s): Lande, Tor Sverre. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 479 pages, biography. BIC Classification: TJF; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 234 x 156 x 26. Weight in Grams: 851.
Format
Hardback
Publication date
1998
Publisher
Kluwer Academic Publishers United States
Number of pages
479
Condition
New
SKU
V9780792381587
ISBN
9780792381587
Hardback
Condition: New

€ 189.64

Paperback. Editor(s): Lande, Tor Sverre. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 479 pages, biography. BIC Classification: PHS; THR; TJFC; UY. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 25. Weight in Grams: 735.
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of the original 1st ed. 1998
Number of pages
479
Condition
New
SKU
V9781475782981
ISBN
9781475782981
Paperback
Condition: New

€ 183.36

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