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Electronics engineering

Results 381 - 400 of 2002

Electronics engineering

Hardback. Proceedings of the NATO Advanced Research Workshop, Reykjavik, Iceland, 5-8 August, 1991 Editor(s): Gardner, Julian W.; Bartlett, P. N. Series: NATO Science Series E:. Num Pages: 335 pages, biography. BIC Classification: TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 297 x 210 x 20. Weight in Grams: 653.
Format
Hardback
Publication date
1992
Publisher
Kluwer Academic Publishers United States
Number of pages
335
Condition
New
SKU
V9780792316930
ISBN
9780792316930
Hardback
Condition: New

€ 249.74

Hardback. Proceedings of the Dutch Sensor Conference held at the University of Twente, The Netherlands, 2-3 March 1998 Editor(s): Berg, A. van den; Bergveld, P. Num Pages: 325 pages, biography. BIC Classification: 1DDN; TDPB; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 20. Weight in Grams: 653.
Format
Hardback
Publication date
1998
Publisher
Kluwer Academic Publishers United States
Number of pages
325
Condition
New
SKU
V9780792350101
ISBN
9780792350101
Hardback
Condition: New

€ 191.35

Hardback. Proceedings of the Sensor Technology Conference 2001, Enschede, The Netherlands, 14-15 May 2001 Editor(s): Elwenspoek, M. Num Pages: 200 pages, biography. BIC Classification: TDPB; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 14. Weight in Grams: 482.
Format
Hardback
Publication date
2001
Publisher
Kluwer Academic Publishers United States
Number of pages
200
Condition
New
SKU
V9780792370123
ISBN
9780792370123
Hardback
Condition: New

€ 127.25

Hardcover. Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field. Series: ECS Series of Texts and Monographs. Num Pages: 320 pages, illustrations. BIC Classification: PHFC; PNRH; TGMT; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 243 x 165 x 23. Weight in Grams: 598.
Format
Hardback
Publication date
1998
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
320
Condition
New
SKU
V9780471574811
ISBN
9780471574811
Hardback
Condition: New

€ 232.84

Hardback. Key advances in Semiconductor Terahertz (THz) Technology now promises important new applications enabling scientists and engineers to overcome the challenges of accessing the so-called "terahertz gap". Series: Wiley - IEEE. Num Pages: 408 pages. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 253 x 176 x 26. Weight in Grams: 798.
Format
Hardback
Publication date
2015
Publisher
John Wiley & Sons Inc
Edition
1st Edition
Condition
New
SKU
V9781118920428
ISBN
9781118920428
Hardback
Condition: New

€ 120.17

Paperback. Editor(s): Awschalom, David D.; Loss, Daniel; Samarth, Nitin. Series: Nanoscience and Technology. Num Pages: 311 pages, biography. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155. Weight in Grams: 557.
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Format
Paperback
Publication date
2010
Edition
Softcover reprint of the original 1st ed. 2002
Condition
New
SKU
V9783642075773
ISBN
9783642075773
Paperback
Condition: New

€ 189.36

Hardcover. An interdisciplinary work offering an introduction to the basic principles and operational characteristics of semiconductor sensors. Describes sensor technology, stressing bulk and surface micromachining. Considers a sensor group related to a special physical, chemical or biological input signal. The final chapter deals with integrated sensors. Editor(s): Sze, Simon M. Num Pages: 576 pages, Illustrations. BIC Classification: PHFC; TJFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 237 x 167 x 35. Weight in Grams: 962.
Format
Hardback
Publication date
1994
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
576
Condition
New
SKU
V9780471546092
ISBN
9780471546092
Hardback
Condition: New

€ 240.38

Hardcover. Editor(s): Sachs, Kenneth G. Num Pages: 399 pages, tables & charts. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 263 x 187 x 32. Weight in Grams: 1090.
Format
Hardback
Publication date
2007
Publisher
Nova Science Publishers Inc United States
Number of pages
399
Condition
New
SKU
V9781600215797
ISBN
9781600215797
Hardback
Condition: New

€ 279.25
€ 189.69

Hardback. The semiconductor optical amplifier has emerged as an important component in many optical fibre communication, switching and signal processing systems. This title provides a comprehensive and detailed treatment of the design and applications of SOAs. Num Pages: 170 pages, biography. BIC Classification: TJFC; TJK. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 12. Weight in Grams: 438.
Format
Hardback
Publication date
2002
Publisher
Kluwer Academic Publishers United States
Number of pages
170
Condition
New
SKU
V9780792376576
ISBN
9780792376576
Hardback
Condition: New

€ 190.67

Paperback. Series: Structure and Bonding. Num Pages: 202 pages, biography. BIC Classification: PNK; PNRH; PNT; TBN; TGMT; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 10. Weight in Grams: 320.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Edition
Softcover reprint of hardcover 1st ed. 2005
Number of pages
202
Condition
New
SKU
V9783642066184
ISBN
9783642066184
Paperback
Condition: New

€ 238.23

Hardcover. Provides the reader with memory fundamentals as well as directions for future research. Examines memory history, current memory technology and offers a glimpse at the future of memories. Num Pages: 822 pages, index. BIC Classification: PHFC; TJFC; UKS. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 257 x 198 x 50. Weight in Grams: 1800.
Format
Hardback
Publication date
1996
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
2nd Edition
Number of pages
822
Condition
New
SKU
V9780471942955
ISBN
9780471942955
Hardback
Condition: New

€ 761.39

Hardback. Editor(s): Paranthaman, M. Parans; Bhattacharya, Raghu N.; Wong-Ng, Winnie K. Series: Springer Series in Materials Science. Num Pages: 293 pages, 15 black & white tables, biography. BIC Classification: PHFC; TGM; THX; TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 18. Weight in Grams: 607.
Format
Hardback
Publication date
2015
Publisher
Springer International Publishing AG Switzerland
Number of pages
293
Condition
New
SKU
V9783319203300
ISBN
9783319203300
Hardback
Condition: New

€ 122.98

Hardcover. This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Num Pages: 800 pages, illustrations. BIC Classification: TJFD5. Category: (P) Professional & Vocational. Dimension: 238 x 164 x 42. Weight in Grams: 1199.
Format
Hardback
Publication date
2006
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
3rd Edition
Number of pages
800
Condition
New
SKU
V9780471739067
ISBN
9780471739067
Hardback
Condition: New

€ 230.33

Hardcover. This reference book provides a fully integrated novel approach to the development of high-power, single-transverse mode, edge-emitting diode lasers by addressing the complementary topics of device engineering, reliability engineering and device diagnostics in the same book, and thus closes the gap in the current book literature. Num Pages: 522 pages, Illustrations. BIC Classification: TJFD5; TTBL. Category: (P) Professional & Vocational. Dimension: 236 x 161 x 30. Weight in Grams: 780.
Format
Hardback
Publication date
2013
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
522
Condition
New
SKU
V9781119990338
ISBN
9781119990338
Hardback
Condition: New

€ 123.44

Paperback. .
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
408
Format
Paperback
Publication date
2011
Edition
Softcover reprint of the original 1st ed. 1987
Condition
New
SKU
V9783642729690
ISBN
9783642729690
Paperback
Condition: New

€ 130.71
€ 20.49

paperback. Num Pages: 258 pages, biography. BIC Classification: PBK; PDE; PHU; TJF; UYQ. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 14. Weight in Grams: 415.
Format
Paperback
Publication date
2011
Publisher
Springer Verlag GmbH Austria
Edition
Softcover reprint of the original 1st ed. 1990
Number of pages
258
Condition
New
SKU
V9783709174524
ISBN
9783709174524
Paperback
Condition: New

€ 121.87

Hardback. This volume offers a new approach to teaching the fundamentals of semiconductor components based on the use of the accompanying process and device simulation software. Users are encouraged to augment their understanding by undertaking simulations and creating their own devices. Num Pages: 346 pages, Illustrations. BIC Classification: PHFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 250 x 174 x 25. Weight in Grams: 744.
Format
Hardback
Publication date
1999
Publisher
John Wiley & Sons Inc United Kingdom
Edition
1st Edition
Number of pages
346
Condition
New
SKU
V9780471988540
ISBN
9780471988540
Hardback
Condition: New

€ 164.95

Paperback. This introductory text presents well-balanced coverage of semiconductor physics and device operation, showing how devices are optimized for applications. Topics such as bandructure, effective masses, holes, doping, carrier transport and lifetimes are all discussed. Num Pages: 576 pages, Ill. BIC Classification: TJFD5; TJKR. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 195 x 30. Weight in Grams: 964.
Format
Paperback
Publication date
2000
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
576
Condition
New
SKU
V9780471362456
ISBN
9780471362456
Paperback
Condition: New

€ 285.58

Hardback. Proceedings of the NATO Advanced Research Workshop, Heraklion, Crete, Greece, June 4-9, 1989 Editor(s): Christou, A.; Unger, B.A. Series: NATO Science Series E:. Num Pages: 585 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 31. Weight in Grams: 1000.
Format
Hardback
Publication date
1989
Publisher
Kluwer Academic Publishers United States
Number of pages
585
Condition
New
SKU
V9780792305361
ISBN
9780792305361
Hardback
Condition: New

€ 369.23

Hardcover. Fault detection has become increasingly difficult as integrated circuits become more and more complex. Photon Emission Microscopy (PEM) is a physical failure analysis technique which locates and identifies faults in integrated circuits. Num Pages: 288 pages, Illustrations. BIC Classification: TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 232 x 160 x 20. Weight in Grams: 534.
Format
Hardback
Publication date
2000
Publisher
John Wiley and Sons Ltd United Kingdom
Edition
1st Edition
Number of pages
288
Condition
New
SKU
V9780471492405
ISBN
9780471492405
Hardback
Condition: New

€ 246.66

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