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Electronics engineering

Results 481 - 504 of 8485

Electronics engineering

Paperback. This book presents the theory, design methodology and fresh applications of integrated circuits for analog signal processing. It covers a wide variety of active devices, active elements and amplifiers, working in voltage mode, current mode and mixed mode. Editor(s): Tlelo-Cuautle, Esteban. Num Pages: 332 pages, 32 black & white tables, biography. BIC Classification: TJFC; TTBM. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 18. Weight in Grams: 510.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
332
Condition
New
SKU
V9781489994578
ISBN
9781489994578
Paperback
Condition: New

€ 166.33

Paperback. This exhaustive survey of advanced simulation methods for modeling nanoscale devices systematically covers both theoretical approaches and numerical solutions, links methodology with the type of device, and includes advice on state-of-the-art semiconductors. Editor(s): Vasileska, Dragica; Goodnick, Stephen M. Num Pages: 452 pages, 6 black & white tables, biography. BIC Classification: TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 23. Weight in Grams: 694.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
452
Condition
New
SKU
V9781489992789
ISBN
9781489992789
Paperback
Condition: New

€ 189.15

paperback. This treatise is a comprehensive review of the highly active field of superconductivity, with particular emphasis on materials where the transition temperature exceeds 40 degrees K. It serves as the authoritative, comprehensive reference work in this field. Editor(s): Schrieffer, J.Robert. Num Pages: 660 pages, biography. BIC Classification: PHF; PHK; TJFD; TJFD5. Category: (G) General (US: Trade). Dimension: 254 x 178 x 34. Weight in Grams: 1237.
Format
Paperback
Publication date
2014
Publisher
Springer United States
Edition
2007th Edition
Number of pages
660
Condition
New
SKU
V9781489990617
ISBN
9781489990617
Paperback
Condition: New

€ 246.67

Paperback. Assessing the major hurdles to be overcome in the design and use of assistive technologies in a number of fields, this interdisciplinary volume blends engineering, computer science and medicine and provides recommendations for improving these technologies. Editor(s): Oishi, Meeko Mitsuko K.; Mitchell, Ian M.; Loos, H. F. Machiel van der. Num Pages: 137 pages, biography. BIC Classification: MQW; TGM; TJFM; UYZG. Category: (G) General (US: Trade). Dimension: 236 x 156 x 15. Weight in Grams: 212.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
137
Condition
New
SKU
V9781489989802
ISBN
9781489989802
Paperback
Condition: New

€ 176.92

paperback. This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field. Num Pages: 594 pages, 80 black & white tables, biography. BIC Classification: PNFS; THRD; TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 31. Weight in Grams: 926.
Format
Paperback
Publication date
2014
Publisher
Springer United States
Edition
2012th Edition
Number of pages
594
Condition
New
SKU
V9781489987976
ISBN
9781489987976
Paperback
Condition: New

€ 308.93

Paperback. Examining energy flow in today's data centers, this book gives particular focus to the state-of-the-art thermal management approaches now being implemented across the globe. Future trends in computing hardware and their possible impacts are also examined. Editor(s): Joshi, Yogendra; Kumar, Pramod. Num Pages: 640 pages, 43 black & white tables, biography. BIC Classification: TGMB; THX; TJFC; TNK. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 36. Weight in Grams: 967.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
640
Condition
New
SKU
V9781489987211
ISBN
9781489987211
Paperback
Condition: New

€ 190.88

Paperback. This book presents a novel approach for Architecture Description Language (ADL)-based instruction-set description that enables the automatic retargeting of the complete software toolkit from a single ADL processor model. Num Pages: 238 pages, 9 black & white tables, biography. BIC Classification: TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 13. Weight in Grams: 373.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
238
Condition
New
SKU
V9781489984050
ISBN
9781489984050
Paperback
Condition: New

€ 166.25

Paperback. This book evaluates strategies for future system design in multiprocessor system-on-chip (MPSoC) architectures. It examines both hardware design and integration of new development tools as well as novel trends in MPSoC design. Editor(s): Hubner, Michael; Becker, Jurgen. Num Pages: 278 pages, biography. BIC Classification: TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 15. Weight in Grams: 433.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
278
Condition
New
SKU
V9781489982469
ISBN
9781489982469
Paperback
Condition: New

€ 187.61

paperback. This text discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. It covers many topics, and it addresses specific failure modes in solder and conductive adhesives at great length. Num Pages: 217 pages, 50 black & white tables, biography. BIC Classification: TDPB; TGPR; TJF; TJFD. Category: (G) General (US: Trade). Dimension: 235 x 155 x 12. Weight in Grams: 343.
Format
Paperback
Publication date
2014
Publisher
Springer United States
Edition
2011th Edition
Number of pages
217
Condition
New
SKU
V9781489982117
ISBN
9781489982117
Paperback
Condition: New

€ 188.10

Paperback. This book covers advances in logic synthesis and design, including Boolean Matching, Logic Decomposition, Boolean satisfiability, Advanced Synthesis Techniques and Applications of Logic Design. Also covers techniques for optimizing VLSI integrated circuits. Editor(s): Gulati, Kanupriya. Num Pages: 444 pages, biography. BIC Classification: TJFC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 23. Weight in Grams: 682.
Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
444
Condition
New
SKU
V9781489981882
ISBN
9781489981882
Paperback
Condition: New

€ 167.69

paperback. This book covers both control theory and wireless sensors, and shows how to utilize wireless network princples to achieve a distributed control. Includes contributions by leading researchers from communications and controls. Editor(s): Mazumder, Sudip K. Num Pages: 356 pages, biography. BIC Classification: TJFM; TJK; UKN. Category: (G) General (US: Trade). Dimension: 235 x 155 x 19. Weight in Grams: 545.
Format
Paperback
Publication date
2014
Publisher
Springer United States
Edition
2011th Edition
Number of pages
356
Condition
New
SKU
V9781489981585
ISBN
9781489981585
Paperback
Condition: New

€ 188.18

Hardcover. Smart Mobile In-Vehicle Systems Editor(s): Schmidt, Gerhard; Abut, Huseyin (San Diego State University, San Diego, California); Takeda, Kazuya (University of Nagoya, Japan); Hansen, John H.L. (University of Colorado at Boulder). Num Pages: 292 pages, 86 black & white illustrations, 79 colour illustrations, 25 black & white tables, 1 colou. BIC Classification: TJFM; TJK; TRC; UYZG. Category: (P) Professional & Vocational. Dimension: 239 x 163 x 18. Weight in Grams: 578.
Format
Hardback
Publication date
2013
Publisher
Springer
Edition
2014th Edition
Condition
New
SKU
V9781461491194
ISBN
9781461491194
Hardback
Condition: New

€ 188.90

Hardback. Routing Algorithms in Networks-on-Chip Editor(s): Palesi, Maurizio; Daneshtalab, Masoud. Num Pages: 424 pages, 122 black & white illustrations, 97 colour illustrations, 40 black & white tables, biogra. BIC Classification: TJFC; UYF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 24. Weight in Grams: 848.
Format
Hardback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Number of pages
424
Condition
New
SKU
V9781461482734
ISBN
9781461482734
Hardback
Condition: New

€ 189.64

Hardback. This book describes a new design approach for energy-efficient, Domain-Specific Instruction set Processor (DSIP) architectures used in the wireless baseband domain. Shows how to reduce development costs and increase scalability. Includes case studies. Editor(s): Catthoor, Francky. Num Pages: 289 pages, 12 black & white tables, biography. BIC Classification: TJFC; TJK; UYF. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 19. Weight in Grams: 631.
Format
Hardback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Number of pages
289
Condition
New
SKU
V9781461449911
ISBN
9781461449911
Hardback
Condition: New

€ 188.62

Hardback. This book covers reliability procedures for lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Addresses reliability engineering, materials, reliability testing and electronic characterization. Editor(s): Ueda, Osamu; Pearton, Steve. Num Pages: 632 pages, 30 black & white tables, biography. BIC Classification: TGMT; TJFC; TJFD; TTBL. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 41. Weight in Grams: 1106.
Format
Hardback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
632
Condition
New
SKU
V9781461443360
ISBN
9781461443360
Hardback
Condition: New

€ 361.97

hardcover. This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field. Num Pages: 594 pages, 80 black & white tables, biography. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 33. Weight in Grams: 1076.
Format
Hardback
Publication date
2012
Publisher
Springer United States
Edition
2012th Edition
Number of pages
594
Condition
New
SKU
V9781461410522
ISBN
9781461410522
Hardback
Condition: New

€ 309.88

Hardcover. This detailed description of high-frequency device modeling approaches the subject from a circuit designer's perspective. Coverage includes a detailed description of both active and passive devices, including modeling techniques and performance optimization. Num Pages: 106 pages, 4 black & white tables, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 7. Weight in Grams: 343.
Format
Hardback
Publication date
2011
Publisher
Springer
Edition
2012th Edition
Condition
New
SKU
V9781461403043
ISBN
9781461403043
Hardback
Condition: New

€ 157.54

paperback. Editor(s): Tsen, Kong-Thon. Num Pages: 517 pages, biography. BIC Classification: PHK; TJF; TTBL. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 26. Weight in Grams: 789.
Format
Paperback
Publication date
2012
Publisher
Springer United States
Edition
Softcover reprint of the original 1st ed. 2001
Number of pages
517
Condition
New
SKU
V9781461265627
ISBN
9781461265627
Paperback
Condition: New

€ 190.25

Hardback. This compilation of contributions from experts across the world addresses readers in academia and industry who are concerned with control system design. It covers theoretical topics, applications in various areas as well as software for bond graph modelling. Editor(s): Borutzky, Wolfgang. Num Pages: 451 pages, biography. BIC Classification: TGB; TJFC; TJFM; UGC. Category: (P) Professional & Vocational. Dimension: 244 x 164 x 33. Weight in Grams: 840.
Format
Hardback
Publication date
2011
Publisher
Springer-Verlag New York Inc. United States
Edition
2011
Number of pages
451
Condition
New
SKU
V9781441993670
ISBN
9781441993670
Hardback
Condition: New

€ 222.08

Hardcover. Exploring the relationship between the human sense of locomotion in virtual environments and the broader scientific and engineering literature on human locomotion and locomotion interfaces, this volume surveys both past and recent developments in the field. Editor(s): Steinicke, Frank; Visell, Yon; Campos, Jennifer; Lecuyer, Anatole. Num Pages: 412 pages, 12 black & white tables, biography. BIC Classification: TJFM; UYV. Category: (P) Professional & Vocational. Dimension: 242 x 160 x 28. Weight in Grams: 752.
Format
Hardback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Edition
2013th Edition
Number of pages
460
Condition
New
SKU
V9781441984319
ISBN
9781441984319
Hardback
Condition: New

€ 189.20

Hardback. Here is a comprehensive examination of CMOS circuits for passive wireless microsystems. Covers design challenges, fundamental issues of ultra-low power wireless communications, radio-frequency power harvesting, and advanced design techniques, and more. Num Pages: 279 pages, biography. BIC Classification: TJFC; TJFD; UGC. Category: (P) Professional & Vocational. Dimension: 243 x 163 x 23. Weight in Grams: 594.
Format
Hardback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Number of pages
279
Condition
New
SKU
V9781441976796
ISBN
9781441976796
Hardback
Condition: New

€ 193.14

Hardback. This book covers advances in logic synthesis and design, including Boolean Matching, Logic Decomposition, Boolean satisfiability, Advanced Synthesis Techniques and Applications of Logic Design. Also covers techniques for optimizing VLSI integrated circuits. Editor(s): Khatri, Sunil P.; Gulati, Kanupriya. Num Pages: 423 pages, biography. BIC Classification: TJFC; UGC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 25. Weight in Grams: 802.
Format
Hardback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Number of pages
423
Condition
New
SKU
V9781441975171
ISBN
9781441975171
Hardback
Condition: New

€ 206.70

Hardback. Examining energy flow in today's data centers, this book gives particular focus to the state-of-the-art thermal management approaches now being implemented across the globe. Future trends in computing hardware and their possible impacts are also examined. Editor(s): Joshi, Yogendra; Kumar, Pramod. Num Pages: 640 pages, 43 black & white tables, biography. BIC Classification: KNBT; TGMB; TJFC; TN; UN. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 34. Weight in Grams: 1118.
Format
Hardback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Edition
2012
Number of pages
640
Condition
New
SKU
V9781441971234
ISBN
9781441971234
Hardback
Condition: New

€ 191.84

Hardback. Assessing the major hurdles to be overcome in the design and use of assistive technologies in a number of fields, this interdisciplinary volume blends engineering, computer science and medicine and provides recommendations for improving these technologies. Editor(s): Oishi, Meeko Mitsuko K.; Mitchell, Ian M.; Loos, H. F. Machiel van der. Num Pages: 117 pages, biography. BIC Classification: MQW; TGM; TJFM; UYZ. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 9. Weight in Grams: 377.
Format
Hardback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Number of pages
117
Condition
New
SKU
V9781441970305
ISBN
9781441970305
Hardback
Condition: New

€ 176.92

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