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Cheng, Yi-Kan; Tsai, Ching-Han (Coordinated Science Laboratory, University Of Illinois, Usa); Teng, Chin-Chi (Silicon Perspective Corporation, Santa  - Electrothermal Analysis of VLSI Systems - 9780792378617 - V9780792378617
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Electrothermal Analysis of VLSI Systems

€ 126.23
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Description for Electrothermal Analysis of VLSI Systems Hardback. Addresses electrothermal problems in modern VLSI systems. This book discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration). Num Pages: 233 pages, 36 black & white illustrations, biography. BIC Classification: TJF; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 14. Weight in Grams: 514.
Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis ... Read more

Product Details

Format
Hardback
Publication date
2000
Publisher
Kluwer Academic Publishers United States
Number of pages
233
Condition
New
Number of Pages
210
Place of Publication
Dordrecht, Netherlands
ISBN
9780792378617
SKU
V9780792378617
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

Reviews for Electrothermal Analysis of VLSI Systems
From the Foreword: `Continuing increases in the levels of circuit integration and concomitant increases in performance are sustaining the trend of increasing power dissipation in VLSI systems. A consequence is that the impact of temperature on the successful operation and reliability of devices must be comprehended during the design process.....This ... Read more

Goodreads reviews for Electrothermal Analysis of VLSI Systems


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