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Singh, P.J.; Viswanadham, P. - Failure Modes and Mechanisms in Electronic Packages - 9780412105913 - V9780412105913
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Failure Modes and Mechanisms in Electronic Packages

€ 188.00
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Description for Failure Modes and Mechanisms in Electronic Packages hardcover. With the proliferation of packaging technology, failure and reliability have become serious concerns. This reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies. Num Pages: 370 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 22. Weight in Grams: 1610.
Those of us who grew up in the "through-hole" age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems almost to take for granted the innovations that leave me somewhat awestruck at times. Electronic circuit designers delight in packing more punch into less volume, while reminding us that their job has become increasingly challenging. The lay person also has learned from the media that the industry has been working wonders in shrinking the transistor and expanding the power of "the chip. ... Read more

Product Details

Format
Hardback
Publication date
1997
Publisher
Springer United Kingdom
Number of pages
370
Condition
New
Number of Pages
370
Place of Publication
London, United Kingdom
ISBN
9780412105913
SKU
V9780412105913
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

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