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Micro-assembly Technologies and Applications
Svetan . Ed(S): Ratchev
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Description for Micro-assembly Technologies and Applications
Hardback. Editor(s): Ratchev, Svetan. Series: IFIP Advances in Information and Communication Technology. Num Pages: 424 pages, biography. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 23. Weight in Grams: 805.
Product Details
Format
Hardback
Publication date
2008
Publisher
Springer-Verlag New York Inc. United States
Number of pages
424
Condition
New
Series
IFIP Advances in Information and Communication Technology
ISBN
9780387774022
SKU
V9780387774022
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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