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Microelectronics Packaging Handbook
Tummala, R. R.; Rymaszewski, E.J.; Klopfenstein, Alan G.
€ 190.59
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Description for Microelectronics Packaging Handbook
Hardback. Provides information on microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This three volume set discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Num Pages: 628 pages, biography. BIC Classification: GBC; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 36. Weight in Grams: 1100.
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design ... Read more
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design ... Read more
Product Details
Format
Hardback
Publication date
1997
Publisher
Chapman and Hall United Kingdom
Number of pages
628
Condition
New
Number of Pages
628
Place of Publication
London, United Kingdom
ISBN
9780412084515
SKU
V9780412084515
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Microelectronics Packaging Handbook
`A most comprehensive book set, both well presented and well illustrated.' IEEE Electrical Insulation Magazine, September/October 1997