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RF and Microwave Microelectronics Packaging
Ken Kuang (Ed.)
€ 190.08
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Description for RF and Microwave Microelectronics Packaging
Hardback. This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields. Editor(s): Kuang, Ken; Kim, Franklin; Cahill, Sean S. Num Pages: 285 pages, 15 black & white tables, biography. BIC Classification: TJFC; TJFN. Category: (P) Professional & Vocational. Dimension: 242 x 165 x 23. Weight in Grams: 594.
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Product Details
Publisher
Springer-Verlag New York Inc.
Format
Hardback
Publication date
2009
Condition
New
Weight
593g
Number of Pages
285
Place of Publication
New York, NY, United States
ISBN
9781441909831
SKU
V9781441909831
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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