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Substrate Noise Coupling in RFICs
Helmy, Ahmed; Ismail, Mohammed
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Description for Substrate Noise Coupling in RFICs
Hardback. Series: Analog Circuits and Signal Processing. Num Pages: 134 pages, biography. BIC Classification: TJFC. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 9. Weight in Grams: 371.
Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ?ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in ... Read more
Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ?ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in ... Read more
Product Details
Format
Hardback
Publication date
2008
Publisher
Springer-Verlag New York Inc. United States
Number of pages
134
Condition
New
Series
Analog Circuits and Signal Processing
Number of Pages
119
Place of Publication
New York, NY, United States
ISBN
9781402081651
SKU
V9781402081651
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
About Helmy, Ahmed; Ismail, Mohammed
Mohammed Ismail is the Springer Series Advisor for the Analog Circuits and Signal Processing book series
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