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The Boundary-Scan Handbook
Kenneth P. Parker
€ 224.39
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Description for The Boundary-Scan Handbook
Hardback. The Boundary-Scan Handbook Num Pages: 500 pages, 200 black & white illustrations. BIC Classification: TJFC; TJFD; UYF. Category: (P) Professional & Vocational. Dimension: 235 x 155. .
Aimed at electronics industry professionals, this 4th edition of the Boundary Scan Handbook describes recent changes to the IEEE1149.1 Standard Test Access Port and Boundary-Scan Architecture. This updated edition features new chapters on the possible effects of the changes on the work of the practicing test engineers and the new 1149.8.1 standard. Anyone needing to understand the basics of boundary scan and its practical industrial implementation will need this book. Provides an overview of the recent changes to the 1149.1 standard and the effect of the changes on the work of test engineers; Explains the new IEEE 1149.8.1 subsidiary ... Read more
Aimed at electronics industry professionals, this 4th edition of the Boundary Scan Handbook describes recent changes to the IEEE1149.1 Standard Test Access Port and Boundary-Scan Architecture. This updated edition features new chapters on the possible effects of the changes on the work of the practicing test engineers and the new 1149.8.1 standard. Anyone needing to understand the basics of boundary scan and its practical industrial implementation will need this book. Provides an overview of the recent changes to the 1149.1 standard and the effect of the changes on the work of test engineers; Explains the new IEEE 1149.8.1 subsidiary ... Read more
Product Details
Publisher
Springer International Publishing AG Switzerland
Number of pages
500
Format
Hardback
Publication date
2015
Condition
New
Weight
1044 g
Number of Pages
552
Place of Publication
Cham, Switzerland
ISBN
9783319011738
SKU
V9783319011738
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
About Kenneth P. Parker
Dr. Kenneth P. Parker received his PHD at Stanford University. He has recently retired from a career with Hewlett-Packard and Agilent Technologies in the field of testing of electrical assemblies.
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