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. Ed(S): Grossmann, Gunter; Zardini, Christian - The Elfnet Book On Failure Mechanisms - 9781447158400 - V9781447158400
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The Elfnet Book On Failure Mechanisms

€ 164.63
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Description for The Elfnet Book On Failure Mechanisms Paperback. This book brings together contributions from the leading European experts in lead-free soldering. It offers comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. Editor(s): Grossmann, Gunter; Zardini, Christian. Num Pages: 321 pages, 26 black & white tables, biography. BIC Classification: TGMT; TGPR; TJF; TJFD. Category: (G) General (US: Trade). Dimension: 235 x 155 x 17. Weight in Grams: 498.

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering.

The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for ... Read more

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.

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Product Details

Format
Paperback
Publication date
2014
Publisher
Springer London Ltd United Kingdom
Number of pages
321
Condition
New
Number of Pages
313
Place of Publication
England, United Kingdom
ISBN
9781447158400
SKU
V9781447158400
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

About . Ed(S): Grossmann, Gunter; Zardini, Christian
Günter Grossmann received his BE degree in Mechanical Engineering in 1981 from the University of Applied Sciences in Winterthur, Switzerland. After his studies, he was employed as Materials Engineer in various companies. From 1989 until 1998 he worked in the Reliability Laboratory of ETH Zurich in the fields of reliability of electronic assemblies, especially of soft solder joints, and in ... Read more

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