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Thermal Transport in Oblique Finned Micro/Minichannels
Fan, Yan; Lee, Poh Seng; Singh, Pawan Kumar; Lee, Yong Jiun
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Description for Thermal Transport in Oblique Finned Micro/Minichannels
Paperback. Series: Springerbriefs in Applied Sciences and Technology/Springerbriefs in Thermal Engineering and Applied Science. Num Pages: 143 pages, 15 black & white illustrations, 80 colour illustrations, biography. BIC Classification: TGBN; TGMB; TGMF; TH; TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 8. Weight in Grams: 277.
The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies.
Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to ... Read more
The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies.
Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to ... Read more
Product Details
Format
Paperback
Publication date
2014
Publisher
Springer International Publishing AG Switzerland
Number of pages
143
Condition
New
Series
Springerbriefs in Applied Sciences and Technology/Springerbriefs in Thermal Engineering and Applied
Number of Pages
130
Place of Publication
Cham, Switzerland
ISBN
9783319096469
SKU
V9783319096469
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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