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John W. . Ed(S): Balde - Foldable Flex and Thinned Silicon Multichip Packaging Technology - 9781461349778 - V9781461349778
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Foldable Flex and Thinned Silicon Multichip Packaging Technology

€ 194.80
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Description for Foldable Flex and Thinned Silicon Multichip Packaging Technology Paperback. Editor(s): Balde, John W. Series: Emerging Technology in Advanced Packaging. Num Pages: 347 pages, 266 black & white illustrations, biography. BIC Classification: PNRP; TGXT; THR; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 569.

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Product Details

Format
Paperback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
347
Condition
New
Series
Emerging Technology in Advanced Packaging
Number of Pages
347
Place of Publication
New York, NY, United States
ISBN
9781461349778
SKU
V9781461349778
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

Reviews for Foldable Flex and Thinned Silicon Multichip Packaging Technology
"If you are responsible for deciding on the next generation of packaging that will be used for your company's application or are steering university research and want to find high impact focus, this book is a must read....By placing all this information between two covers and having the various perspectives of the many authors clash and add to each other ... Read more

Goodreads reviews for Foldable Flex and Thinned Silicon Multichip Packaging Technology


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