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High-frequency Characterization of Electronic Packaging
Luc Martens
€ 125.62
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Description for High-frequency Characterization of Electronic Packaging
Hardback. Offers an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. Series: Electronic Packaging and Interconnects. Num Pages: 158 pages, biography. BIC Classification: TJFN. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 426.
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.
High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that ... Read more
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.
High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that ... Read more
Product Details
Format
Hardback
Publication date
1998
Publisher
Kluwer Academic Publishers United States
Number of pages
158
Condition
New
Series
Electronic Packaging and Interconnects
Number of Pages
158
Place of Publication
Dordrecht, Netherlands
ISBN
9780792383079
SKU
V9780792383079
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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