Interconnect Technology and Design for Gigascale Integration
. Ed(S): Davis, Jeffrey A. (College Of Computing, Georgia Institute Of Technology, Atlanta, Usa); Meindl, James D.
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Description for Interconnect Technology and Design for Gigascale Integration
Hardback. Includes topics ranging from IBM's revolutionary copper process to an exploration into interconnect-aware computer architectures. Editor(s): Davis, Jeffrey A. (College of Computing, Georgia Institute of Technology, Atlanta, USA); Meindl, James D. Num Pages: 411 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 23. Weight in Grams: 779.
Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications ... Read more
Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications ... Read more
Product Details
Format
Hardback
Publication date
2003
Publisher
Kluwer Academic Publishers United States
Number of pages
411
Condition
New
Number of Pages
411
Place of Publication
New York, NY, United States
ISBN
9781402076060
SKU
V9781402076060
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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