.png){kind=logo}
Stock image for illustration purposes only - book cover, edition or condition may vary.
Low Dielectric Constant Materials for IC Applications
. Ed(S): Ho, P. S.; Lee, Wei William; Leu, Jihperng
€ 200.59
FREE Delivery in Ireland
Description for Low Dielectric Constant Materials for IC Applications
Hardback. Low dielectric materials are an important component of microelectronic devices. This book provides an introduction to and a survey of the various fields of dielectrics for IC integration. It is of interest to materials researchers, electrical engineers and advanced students. Editor(s): Ho, P. S.; Lee, Wei William; Leu, Jihperng. Series: Springer Series in Advanced Microelectronics. Num Pages: 329 pages, biography. BIC Classification: PHK; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 19. Weight in Grams: 647.
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices ... Read more
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices ... Read more
Product Details
Format
Hardback
Publication date
2002
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
329
Condition
New
Series
Springer Series in Advanced Microelectronics
Number of Pages
310
Place of Publication
Berlin, Germany
ISBN
9783540678199
SKU
V9783540678199
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Low Dielectric Constant Materials for IC Applications
From the reviews: Praise for P.S. Ho, J. Leu, and W.W. Lee, Ed's, Low Dielectric Constant Materials for IC Applications Electrical Insulation Magazine "Because this volume contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researches, material scientists, and polymer engineers working ... Read more