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More-Than-Moore 2.5d and 3D Sip Integration
Riko Radojcic
€ 149.87
FREE Delivery in Ireland
Description for More-Than-Moore 2.5d and 3D Sip Integration
Hardback. Num Pages: 182 pages, 2 black & white illustrations, 66 colour illustrations, 58 colour tables, biography. BIC Classification: TJFC; UK; UYF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 13. Weight in Grams: 467.
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, ... Read more
Show LessProduct Details
Format
Hardback
Publication date
2017
Publisher
Springer International Publishing AG Switzerland
Number of pages
182
Condition
New
Number of Pages
182
Place of Publication
Cham, Switzerland
ISBN
9783319525471
SKU
V9783319525471
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
About Riko Radojcic
Riko Radojcic is currently an independent consultant specialized in design and manufacturing with advanced semiconductor and packaging technologies, with a focus on 2.5D and 3D integration options and opportunities. Most recently, he was a Senior Director of Technology at Qualcomm Technologies Inc. where he led the 2.5D and 3D Technology Integration team, addressing all aspects of ... Read more
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