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Package Electrical Modeling, Thermal Modeling, and Processing for Gaas Wireless Applications
Dean L. Monthei
€ 126.32
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Description for Package Electrical Modeling, Thermal Modeling, and Processing for Gaas Wireless Applications
Hardback. Reviews the practical aspects of electrical and thermal modeling of packages. This book emphasizes low-cost industry-standard packages. It is suitable for engineers and professionals in the field of wireless packaging. Series: Electronic Packaging and Interconnects. Num Pages: 234 pages, 62 black & white illustrations, biography. BIC Classification: TJFN. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 15. Weight in Grams: 1170.
This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the principles involved translate well to other categories of packages. Digital issues such as crosstalk are well documented in other books and are therefore not covered in detail in this text. The principles for generation of equivalent circuit package models applies to both digital and analog parts. Digital designers and packaging engineers should still find this text useful. Subtleties often overlooked by standard methods of modeling ... Read more
This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the principles involved translate well to other categories of packages. Digital issues such as crosstalk are well documented in other books and are therefore not covered in detail in this text. The principles for generation of equivalent circuit package models applies to both digital and analog parts. Digital designers and packaging engineers should still find this text useful. Subtleties often overlooked by standard methods of modeling ... Read more
Product Details
Format
Hardback
Publication date
1998
Publisher
Kluwer Academic Publishers United States
Number of pages
234
Condition
New
Series
Electronic Packaging and Interconnects
Number of Pages
234
Place of Publication
Dordrecht, Netherlands
ISBN
9780792383642
SKU
V9780792383642
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Package Electrical Modeling, Thermal Modeling, and Processing for Gaas Wireless Applications