Eric Bogatin received his B.S. in Physics from MIT in 1976 and his M.S. and Ph.D. in Physics from the University of Arizona in Tucson in 1980. For more than 30 years he has been active in the fields of signal integrity and interconnect design. He worked in senior engineering and management roles at AT&T Bell Labs, Raychem Corp, Sun ... Read moreMicrosystems, Interconnect Devices Inc., and Teledyne LeCroy. In 2011, his company, Bogatin Enterprises, was acquired by Teledyne LeCroy. Eric currently is a Signal Integrity Evangelist with Teledyne LeCroy, where he creates and presents educational materials related to new applications for high-performance scopes. Eric turns complexity into practical design and measurement principles, leveraging analysis techniques and measurement tools. Since 2012, he has been an adjunct professor at the University of Colorado in Boulder, teaching graduate courses in signal integrity, interconnect design, and PCB design. He has written regular monthly columns for PCD&F Magazine, Semiconductor International, Electronic Packaging and Production, Altera Corporation, Mentor Graphics Corporation, EDN, and EE Times. He is currently the editor of the Signal Integrity Journal (www.SignalIntegrityJournal.com ) Eric is a prolific author with more than 300 publications, many posted on his website, www.beTheSignal.com, for download. He regularly presents at DesignCon, the IEEE EMC Symposium, EDI con, and at IPC's Designer Council events. He is the coauthor of the popular Prentice Hall book, Principles of Power Integrity for PDN Design - Simplified, along with Larry Smith. He was the recipient of the 2016 Engineer of the Year Award from DesignCon. He can be reached at eric@beTheSignal.com. Show Less