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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Verghese, Nishath K.; Schmerbeck, Timothy J.; Allstot, David J.
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Description for Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Paperback. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 280 pages, biography. BIC Classification: THR; TJFC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 17. Weight in Grams: 474.
The goal ofputting "systems on a chip" has been a difficultchallenge that is only recently beginning to be met. Since the world is "analog"putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir- cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig- ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the ... Read more
The goal ofputting "systems on a chip" has been a difficultchallenge that is only recently beginning to be met. Since the world is "analog"putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir- cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig- ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
280
Condition
New
Series
The Springer International Series in Engineering and Computer Science
Number of Pages
280
Place of Publication
New York, NY, United States
ISBN
9781461359425
SKU
V9781461359425
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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