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Solder Paste in Electronics Packaging
Jennie S. Hwang
€ 123.91
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Description for Solder Paste in Electronics Packaging
Paperback. Aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of current surface mount technology. Coverage includes basic technologies, application techniques, reliability and solutions to specific problems. Num Pages: 480 pages, 77 black & white illustrations, biography. BIC Classification: TGP; THRS; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 24. Weight in Grams: 703.
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is ... Read more
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is ... Read more
Product Details
Format
Paperback
Publication date
1992
Publisher
Kluwer Academic Publishers Group Netherlands
Number of pages
480
Condition
New
Number of Pages
456
Place of Publication
, United States
ISBN
9780442013530
SKU
V9780442013530
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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