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Rymaszewski, Eugene J.; Klopfenstein, Alan G.; Tummala, R. R. - Microelectronics Packaging Handbook - 9781461368298 - V9781461368298
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Microelectronics Packaging Handbook

€ 237.20
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Description for Microelectronics Packaging Handbook Paperback. Num Pages: 720 pages, biography. BIC Classification: THR; TJF; UYF. Category: (G) General (US: Trade). Dimension: 235 x 155 x 38. Weight in Grams: 1133.
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. ... Read more

Product Details

Format
Paperback
Publication date
1997
Publisher
Springer-Verlag New York Inc. United States
Number of pages
720
Condition
New
Number of Pages
720
Place of Publication
New York, NY, United States
ISBN
9781461368298
SKU
V9781461368298
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15

Reviews for Microelectronics Packaging Handbook
`A most comprehensive book set, both well presented and well illustrated.' IEEE Electrical Insulation Magazine, September/October 1997

Goodreads reviews for Microelectronics Packaging Handbook


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