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Wireless and Mobile Communications
. Ed(S): Holtzman, Jack M.; Goldman, N.; Goodman, David J.
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Description for Wireless and Mobile Communications
Paperback. Editor(s): Holtzman, Jack M.; Goldman, N.; Goodman, David J. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 286 pages, biography. BIC Classification: THR; TTBM. Category: (G) General (US: Trade). Dimension: 235 x 155 x 16. Weight in Grams: 468.
In October 1993, the Rutgers University Wireless Infonnation Network Laboratory hosted the fourth WINLAB Workshop on Third Generation Wireless Infonnation Networks. These events bring together a select group of experts interested in the long tenn future of Personal Communications, Mobile Computing, and other services supported by wireless telecommunications technology. This is a fast moving field and we already see, in present practice, realizations of visions articulated in the earlier Workshops. In particular, the second generation systems that absorbed the attention of the first WINLAB Workshop, are now commercial products. It is an interesting reflection on the state of knowledge of ... Read more
In October 1993, the Rutgers University Wireless Infonnation Network Laboratory hosted the fourth WINLAB Workshop on Third Generation Wireless Infonnation Networks. These events bring together a select group of experts interested in the long tenn future of Personal Communications, Mobile Computing, and other services supported by wireless telecommunications technology. This is a fast moving field and we already see, in present practice, realizations of visions articulated in the earlier Workshops. In particular, the second generation systems that absorbed the attention of the first WINLAB Workshop, are now commercial products. It is an interesting reflection on the state of knowledge of ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
286
Condition
New
Series
The Springer International Series in Engineering and Computer Science
Number of Pages
286
Place of Publication
New York, NY, United States
ISBN
9781461361701
SKU
V9781461361701
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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