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Failure Analysis of Integrated Circuits
Lawrence C. . Ed(S): Wagner
€ 185.78
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Description for Failure Analysis of Integrated Circuits
hardcover. Provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. This book also includes the coverage of the shortcomings, limitations, and strengths of each technique. Editor(s): Wagner, Lawrence C. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 255 pages, biography. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 17. Weight in Grams: 565.
Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. ... Read more
Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. ... Read more
Product Details
Format
Hardback
Publication date
1999
Publisher
Chapman and Hall United Kingdom
Number of pages
255
Condition
New
Series
The Springer International Series in Engineering and Computer Science
Number of Pages
255
Place of Publication
London, United Kingdom
ISBN
9780412145612
SKU
V9780412145612
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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