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Failure Modes and Mechanisms in Electronic Packages
Singh, P.J.; Viswanadham, Puligandla
€ 200.21
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Description for Failure Modes and Mechanisms in Electronic Packages
Paperback. Num Pages: 370 pages, biography. BIC Classification: TD; THR; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 20. Weight in Grams: 605.
Those of us who grew up in the "through-hole" age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems almost to take for granted the innovations that leave me somewhat awestruck at times. Electronic circuit designers delight in packing more punch into less volume, while reminding us that their job has become increasingly challenging. The lay person also has learned from the media that the industry has been working wonders in shrinking the transistor and expanding the power of "the chip. ... Read more
Those of us who grew up in the "through-hole" age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems almost to take for granted the innovations that leave me somewhat awestruck at times. Electronic circuit designers delight in packing more punch into less volume, while reminding us that their job has become increasingly challenging. The lay person also has learned from the media that the industry has been working wonders in shrinking the transistor and expanding the power of "the chip. ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
370
Condition
New
Number of Pages
370
Place of Publication
New York, NY, United States
ISBN
9781461377634
SKU
V9781461377634
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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