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Flow Boiling in Microgap Channels
Alam, Tamanna; Lee, Poh Seng; Jin, Liwen
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Description for Flow Boiling in Microgap Channels
Paperback. Series: Springerbriefs in Applied Sciences and Technology/Springerbriefs in Thermal Engineering and Applied Science. Num Pages: 95 pages, 17 black & white illustrations, 49 colour illustrations, 5 black & white tables, biography. BIC Classification: TGMB. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 5. Weight in Grams: 161.
Flow Boiling in Microgap Channels: Experiment, Visualization and Analysis presents an up-to-date summary of the details of the confined to unconfined flow boiling transition criteria, flow boiling heat transfer and pressure drop characteristics, instability characteristics, two phase flow pattern and flow regime map and the parametric study of microgap dimension. Advantages of flow boiling in microgaps over microchannels are also highlighted. The objective of this Brief is to obtain a better fundamental understanding of the flow boiling processes, compare the performance between microgap and conventional microchannel heat sinks, and evaluate the microgap heat sink for instabilities and hotspot mitigation.
Flow Boiling in Microgap Channels: Experiment, Visualization and Analysis presents an up-to-date summary of the details of the confined to unconfined flow boiling transition criteria, flow boiling heat transfer and pressure drop characteristics, instability characteristics, two phase flow pattern and flow regime map and the parametric study of microgap dimension. Advantages of flow boiling in microgaps over microchannels are also highlighted. The objective of this Brief is to obtain a better fundamental understanding of the flow boiling processes, compare the performance between microgap and conventional microchannel heat sinks, and evaluate the microgap heat sink for instabilities and hotspot mitigation.
Product Details
Format
Paperback
Publication date
2013
Publisher
Springer-Verlag New York Inc. United States
Number of pages
95
Condition
New
Series
Springerbriefs in Applied Sciences and Technology/Springerbriefs in Thermal Engineering and Applied
Number of Pages
84
Place of Publication
New York, NY, United States
ISBN
9781461471899
SKU
V9781461471899
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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