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Fundamentals of Lead-Free Solder Interconnect Technology
Lee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un; Ma, Hongtao
€ 128.39
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Description for Fundamentals of Lead-Free Solder Interconnect Technology
Hardcover. Num Pages: 266 pages, 70 black & white illustrations, 81 colour illustrations, 18 black & white tables, biograp. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational. Dimension: 241 x 163 x 16. Weight in Grams: 526.
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Product Details
Format
Hardback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
266
Condition
New
Number of Pages
253
Place of Publication
New York, NY, United States
ISBN
9781461492658
SKU
V9781461492658
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Fundamentals of Lead-Free Solder Interconnect Technology
From the book reviews: “The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals ... Read more