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High Thermal Conductivity Materials
. Ed(S): Shinde, Subhash L.; Goela, Jitendra
€ 181.73
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Description for High Thermal Conductivity Materials
Hardback. Editor(s): Shinde, Subhash L.; Goela, Jitendra. BIC Classification: PHF. Dimension: 235 x 155. Weight in Grams: 587.
Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth’s atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned ... Read more
Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth’s atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned ... Read more
Product Details
Format
Hardback
Publication date
2005
Publisher
Springer New York
Language
English
Condition
New
Number of Pages
271
Place of Publication
New York, NY, United States
ISBN
9780387220215
SKU
V9780387220215
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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