Solder Joint Technology: Materials, Properties, and Reliability (Volume 92)
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Description for Solder Joint Technology: Materials, Properties, and Reliability (Volume 92)
hardcover. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. This book emphasizes the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints. It discusses methods to prevent these reliability problems. Series: Springer Series in Materials Science. Num Pages: 386 pages, biography. BIC Classification: TDM. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 23. Weight in Grams: 719.
Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must ... Read more
Show LessProduct Details
Format
Hardback
Publication date
2007
Publisher
Springer/Sci-Tech/Trade United States
Number of pages
386
Condition
New
Series
Springer Series in Materials Science
Number of Pages
370
Place of Publication
New York, NY, United States
ISBN
9780387388908
SKU
V9780387388908
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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