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Electronics Packaging Forum
James E. Morris
€ 67.43
FREE Delivery in Ireland
Description for Electronics Packaging Forum
paperback. Num Pages: 357 pages, 54 black & white illustrations, biography. BIC Classification: TDP; TJF. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 19. Weight in Grams: 527.
This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant visibility in recent years as it has become obvious that the near-future ... Read more
This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant visibility in recent years as it has become obvious that the near-future ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer Netherlands
Number of pages
357
Condition
New
Number of Pages
347
Place of Publication
Dordrecht, Netherlands
ISBN
9789401092883
SKU
V9789401092883
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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