Joining Processes
David Brandon
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Description for Joining Processes
Paperback. Joining Processes An Introduction David Brandon and Wayne D. Kaplan Technion, Israel Institute of Technology, Israel This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. Num Pages: 378 pages, colour diagrams. BIC Classification: TGB; TGM; TGP. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 224 x 149 x 22. Weight in Grams: 530.
This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately ... Read more
Show LessProduct Details
Format
Paperback
Publication date
1997
Publisher
John Wiley and Sons Ltd United Kingdom
Number of pages
378
Condition
New
Number of Pages
384
Place of Publication
New York, United States
ISBN
9780471964889
SKU
V9780471964889
Shipping Time
Usually ships in 7 to 11 working days
Ref
99-50
About David Brandon
David Brandon,Technion, Israel Institute of Technology, Israel, is the author of Joining Processes: An Introduction, published by Wiley. Wayne D. Kaplan, Technion, Israel Institute of Technology, Israel, is the author of Joining Processes: An Introduction, published by Wiley.
Reviews for Joining Processes
"This is a very informative book which groups together a number of varied topics." —Assembly Automation, Vol 20/2, 2000