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Manufacturing Challenges in Electronic Packaging
. Ed(S): Lee, Y. C.; Chen, W.T.
€ 127.54
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Description for Manufacturing Challenges in Electronic Packaging
Paperback. Editor(s): Lee, Y. C.; Chen, W.T. Num Pages: 261 pages, biography. BIC Classification: TD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 14. Weight in Grams: 427.
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take ... Read more
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
261
Condition
New
Number of Pages
261
Place of Publication
New York, NY, United States
ISBN
9781461376590
SKU
V9781461376590
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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