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Mechanical engineering & materials

Results 2521 - 2540 of 10943

Mechanical engineering & materials

Paperback. Editor(s): Bath, Jasbir. Num Pages: 299 pages, biography. BIC Classification: LNKJ; TGM; TJFC; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 16. Weight in Grams: 486.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
299
Condition
New
SKU
V9781441940834
ISBN
9781441940834
Paperback
Condition: New

€ 183.20

Paperback. Num Pages: 775 pages, biography. BIC Classification: TGP. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 40. Weight in Grams: 1372.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2008
Number of pages
775
Condition
New
SKU
V9781441940841
ISBN
9781441940841
Paperback
Condition: New

€ 144.84

Paperback. Editor(s): Sisodia, Sangram S.; Tanzi, Rudolph. Num Pages: 286 pages, 19 black & white illustrations, 5 colour illustrations, 4 black & white tables, biography. BIC Classification: MJND; MMG; PSAN; TGB. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 15. Weight in Grams: 456.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
286
Condition
New
SKU
V9781441941954
ISBN
9781441941954
Paperback
Condition: New

€ 194.08

Paperback. A reference and source book for process design, tool and production engineers in composite manufacturing. It provides the reader with a treatment of the theory of machining as it applies to fiber reinforced polymer composites. Num Pages: 230 pages, 131 black & white illustrations, 47 black & white tables, biography. BIC Classification: PNNP; TDCQ; TGM; TGP. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 17. Weight in Grams: 504.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2009
Number of pages
230
Condition
New
SKU
V9781441942043
ISBN
9781441942043
Paperback
Condition: New

€ 128.07

Paperback. Thin films and nanostructures play key roles in a sensor, including structural support, reliability enhancement, and transduction. These materials are discussed here in the context of transduction and how they contribute to today's sensor revolution. Editor(s): Zribi, Anis; Fortin, Jeffrey B. (Electronic Materials and Manufacturing Laboratory, Nisakyauna, New York, USA). Series: Integrated Analytical Systems. Num Pages: 214 pages, 100 black & white illustrations, biography. BIC Classification: TBN; TGMT; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 12. Weight in Grams: 361.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2009
Number of pages
214
Condition
New
SKU
V9781441942111
ISBN
9781441942111
Paperback
Condition: New

€ 127.73

Paperback. Editor(s): Kwon, Young W.; Allen, David H.; Talreja, Ramesh R. Num Pages: 630 pages, biography. BIC Classification: TBC; TDCQ; TGB; TGM. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 32. Weight in Grams: 967.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2008
Number of pages
630
Condition
New
SKU
V9781441942135
ISBN
9781441942135
Paperback
Condition: New

€ 252.70

Paperback. Compiled from industrial and academic lecture notes and reflecting years of experience in the development of silicon devices, this book covers both their theoretical and practical aspects, and how their electrical properties and processing conditions interact. Num Pages: 598 pages, 17 black & white tables, biography. BIC Classification: TGM; TJFC. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 31. Weight in Grams: 943.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2009
Number of pages
598
Condition
New
SKU
V9781441942241
ISBN
9781441942241
Paperback
Condition: New

€ 142.09

paperback. A textbook for senior undergraduate and graduate level students that offers a novel and systematic look into the dynamics of MEMS. It includes numerous solved examples together with the proposed problems. Series: Microsystems. Num Pages: 403 pages, biography. BIC Classification: TGB. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 21. Weight in Grams: 635.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of hardcover 1st ed. 2007
Number of pages
403
Condition
New
SKU
V9781441942258
ISBN
9781441942258
Paperback
Condition: New

€ 68.13

Paperback. Num Pages: 687 pages, 180 black & white illustrations, biography. BIC Classification: PHD; TBN; TDCQ; TGB; TGMD; TGMT; UGK. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 35. Weight in Grams: 1068.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
687
Condition
New
SKU
V9781441942272
ISBN
9781441942272
Paperback
Condition: New

€ 198.10

Paperback. Series: Mechanical Engineering Series. Num Pages: 226 pages, biography. BIC Classification: TGMD5. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 12. Weight in Grams: 321.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
226
Condition
New
SKU
V9781441942418
ISBN
9781441942418
Paperback
Condition: New

€ 194.05

Paperback. Investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects. This title deals with the requirements for integrated computation and MEMs sensors, system-in-a-package solutions, and multi-chip modules. Editor(s): Delaney, Kieran. Series: Microsystems. Num Pages: 422 pages, 9 black & white tables, biography. BIC Classification: TBC; TGM; TJF; UYQ. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 22. Weight in Grams: 664.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Number of pages
422
Condition
New
SKU
V9781441942777
ISBN
9781441942777
Paperback
Condition: New

€ 195.42

Paperback. This book develops a complete and rigorous state-of-the-art analysis of the modeling of the mechanical behavior of nanocrystalline materials. It presents recent theoretical and computational frameworks combining atomistic and continuum approaches. Series: Springer Series in Materials Science. Num Pages: 500 pages, 103 black & white illustrations, 4 black & white tables, biography. BIC Classification: PNFC; PNFS; TBN; TGMT. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 21. Weight in Grams: 578.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of hardcover 1st ed. 2009
Number of pages
500
Condition
New
SKU
V9781441942869
ISBN
9781441942869
Paperback
Condition: New

€ 195.97

Paperback. Editor(s): Kamrani, Ali K.; Nasr, Emad Abouel. Num Pages: 287 pages, 104 black & white illustrations, 2 colour illustrations, 28 black & white tables, biograp. BIC Classification: KJMV5; TBD; TDP; TGPQ. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 16. Weight in Grams: 474.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2008
Number of pages
287
Condition
New
SKU
V9781441942883
ISBN
9781441942883
Paperback
Condition: New

€ 127.85

Paperback. Editor(s): Bejan, Adrian; Merkx, G.W. Num Pages: 367 pages, biography. BIC Classification: PBKS; PBW; PHS; TBD; TGMB. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 19. Weight in Grams: 563.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
367
Condition
New
SKU
V9781441942951
ISBN
9781441942951
Paperback
Condition: New

€ 250.03

Paperback. This book explores the modeling and engineering applications of shape memory alloys (SMAs), beginning with a rigorous introduction to continuum mechanics and continuum thermodynamics as related to SMA modeling. The text presents a unified approach to the constitutive modeling of SMAs. Editor(s): Lagoudas, Dimitris C. Num Pages: 436 pages, 85 black & white illustrations, biography. BIC Classification: TDCK; TGB; TGMB. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 23. Weight in Grams: 694.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2008
Number of pages
436
Condition
New
SKU
V9781441942975
ISBN
9781441942975
Paperback
Condition: New

€ 251.01

Paperback. Num Pages: 266 pages, biography. BIC Classification: TGP. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 14. Weight in Grams: 415.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
266
Condition
New
SKU
V9781441942982
ISBN
9781441942982
Paperback
Condition: New

€ 127.78

Paperback. Editor(s): Subramanian, Kanakasabapathi. Num Pages: 378 pages, biography. BIC Classification: TGB; TGM; TGPQ; TJFD. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 20. Weight in Grams: 728.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2007
Number of pages
378
Condition
New
SKU
V9781441943026
ISBN
9781441943026
Paperback
Condition: New

€ 251.11

Paperback. Editor(s): Miller, Michael; Liaw, P. K. Num Pages: 290 pages, 100 black & white illustrations, biography. BIC Classification: TBN; TDCQ; TDM; TGMT. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 13. Weight in Grams: 364.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2008
Number of pages
290
Condition
New
SKU
V9781441943132
ISBN
9781441943132
Paperback
Condition: New

€ 194.08

Paperback. This book on the stiffness and strength of engineering systems integrates a wide array of topics into a unified text, including plasticity, fracture, composite materials, energy approaches, and mechanics of microdevices (MEMs). Series: Mechanical Engineering Series. Num Pages: 712 pages, 475 black & white illustrations, 50 black & white tables, biography. BIC Classification: TGB; TGM; UGC. Category: (P) Professional & Vocational. Dimension: 255 x 175 x 38. Weight in Grams: 1242.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
1st ed. Softcover of orig. ed. 2009
Number of pages
712
Condition
New
SKU
V9781441943170
ISBN
9781441943170
Paperback
Condition: New

€ 122.49

Paperback. This book covers the mechanics of solid bodies in contact, detailing the mechanical properties of materials, general fracture mechanics, and the fracture of brittle solids. It describes indentation stress fields for both elastic and elastic-plastic contact. Series: Mechanical Engineering Series. Num Pages: 248 pages, biography. BIC Classification: TGB; TGMF. Category: (P) Professional & Vocational. Dimension: 244 x 170 x 13. Weight in Grams: 433.
Format
Paperback
Publication date
2010
Publisher
Springer-Verlag New York Inc. United States
Edition
Softcover reprint of hardcover 2nd ed. 2007
Number of pages
248
Condition
New
SKU
V9781441943262
ISBN
9781441943262
Paperback
Condition: New

€ 194.05

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