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Mechanical engineering & materials

Results 1341 - 1360 of 1766

Mechanical engineering & materials

Hardcover. Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals. Num Pages: 464 pages, bibliography. BIC Classification: TGPR; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 238 x 163 x 31. Weight in Grams: 840.
Format
Hardback
Publication date
1994
Publisher
John Wiley and Sons Ltd United States
Number of pages
464
Condition
New
SKU
V9780471594468
ISBN
9780471594468
Hardback
Condition: New

€ 211.67

Hardcover. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted. Editor(s): Pecht, Michael; Dasgupta, Abhijit; Evans, John W.; Evans, Jillian Y. Num Pages: 462 pages, Illustrations. BIC Classification: KJMV5; TGPQ; TGPR; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 243 x 163 x 29. Weight in Grams: 888.
Format
Hardback
Publication date
1994
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
462
Condition
New
SKU
V9780471594369
ISBN
9780471594369
Hardback
Condition: New

€ 190.19

Hardcover. Gets professionals quickly on--line with all the crucial design concepts and skills they need to dramatically improve the maintainability of their products or systems Maintainability is a practical, step--by--step guide to implementing a comprehensive maintainability program within your organizationa s design and development function. Series: New Dimensions in Engineering Series. Num Pages: 560 pages, Illustrations. BIC Classification: KJMV5; TGPQ. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 164 x 36. Weight in Grams: 960.
Format
Hardback
Publication date
1995
Publisher
John Wiley and Sons Ltd United States
Edition
2nd
Number of pages
560
Condition
New
SKU
V9780471591320
ISBN
9780471591320
Hardback
Condition: New

€ 207.65

Hardcover. Takes into account the human element as well as the classical aspects of mechanical, electrical and chemical designs that contribute to risk. Features a significant amount of data essential for risk analysis not normally available. Contains numerous examples of authentic applications and case studies. Num Pages: 472 pages, Illustrations. BIC Classification: KNXC; TBC; TGPR. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 244 x 165 x 32. Weight in Grams: 854.
Format
Hardback
Publication date
1993
Publisher
John Wiley and Sons Ltd United States
Edition
3rd Edition
Number of pages
472
Condition
New
SKU
V9780471591108
ISBN
9780471591108
Hardback
Condition: New

€ 191.68

Paperback. To survive in globally competitive markets manufacturers are going to have to develop a system for mass customization of products. This valuable resource is designed to prepare readers for the future by training them in the latest technologies and processes in the areas of design, manufacturing, and tools of integration. Num Pages: 664 pages, illustrations. BIC Classification: TGPC; UGC. Category: (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 253 x 177 x 35. Weight in Grams: 1150.
Format
Paperback
Publication date
1995
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
664
Condition
New
SKU
V9780471585176
ISBN
9780471585176
Paperback
Condition: New

€ 295.21

Hardcover. This study reviews an important reliability issue for both silicon and GaAs technologies. It surveys the status of electromigration physics in microelectronics, and summarizes various rate controlling details. Editor(s): Christou, Aris. Num Pages: 344 pages, black & white illustrations. BIC Classification: PHK; TGPR; TJK; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 236 x 165 x 26. Weight in Grams: 682.
Format
Hardback
Publication date
1993
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
344
Condition
New
SKU
V9780471584896
ISBN
9780471584896
Hardback
Condition: New

€ 274.87

Hardcover. Describing the different soldering methods in use today, this guide presents both their theory and practical applications. It covers the topics of cleaning, statistical quality control, through-hole and joining. The author relates all theory to practical, on-site situations. Num Pages: 400 pages, index. BIC Classification: TDM; TGX; TNT. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 236 x 163 x 28. Weight in Grams: 696.
Format
Hardback
Publication date
1993
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
400
Condition
New
SKU
V9780471584711
ISBN
9780471584711
Hardback
Condition: New

€ 309.40

Hardcover. A comprehensive and rigorous introduction to thermal system design from a contemporary perspective Thermal Design and Optimization offers readers a lucid introduction to the latest methodologies for the design of thermal systems and emphasizes engineering economics, system simulation, and optimization methods. Num Pages: 560 pages, Illustrations. BIC Classification: TGMB. Category: (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 237 x 166 x 40. Weight in Grams: 980.
Format
Hardback
Publication date
1995
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
560
Condition
New
SKU
V9780471584674
ISBN
9780471584674
Hardback
Condition: New

€ 188.05

Hardcover. Addresses fundamentals and advanced topics relevant to the behavior of materials under in-service conditions such as impact, shock, stress and high-strain rate deformations. Deals extensively with materials from a microstructure perspective which is the future direction of research today. Num Pages: 688 pages, Ill. BIC Classification: TGMD; TGMT. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 238 x 159 x 45. Weight in Grams: 1158.
Format
Hardback
Publication date
1994
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
688
Condition
New
SKU
V9780471582625
ISBN
9780471582625
Hardback
Condition: New

€ 250.12

Hardcover. Integrating discussion of elemental (silicon) and compound (gallium arsenide) technologies, this monograph explains why the two materials are particularly suited to Very Large Scale Integrated (VLSI) schemes. The fabrication principles for circuits such as CMOS, MOS and PET are emphasized. Num Pages: 864 pages, Illustrations. BIC Classification: TGM; TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 240 x 163 x 44. Weight in Grams: 1292.
Format
Hardback
Publication date
1994
Publisher
John Wiley and Sons Ltd United States
Edition
2nd Edition
Number of pages
864
Condition
New
SKU
V9780471580058
ISBN
9780471580058
Hardback
Condition: New

€ 220.79

Hardcover. A modern and broad exposition emphasizing heat transfer by convection. This edition contains valuable new information primarily pertaining to flow and heat transfer in porous media and computational fluid dynamics as well as recent advances in turbulence modeling. Num Pages: 640 pages, black & white illustrations. BIC Classification: PHH; TGMB. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 239 x 161 x 46. Weight in Grams: 1184.
Format
Hardback
Publication date
1993
Publisher
John Wiley and Sons Ltd United States
Edition
2nd Edition
Number of pages
640
Condition
New
SKU
V9780471577096
ISBN
9780471577096
Hardback
Condition: New

€ 247.38

Hardcover. Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field. Series: ECS Series of Texts and Monographs. Num Pages: 320 pages, illustrations. BIC Classification: PHFC; PNRH; TGMT; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 243 x 165 x 23. Weight in Grams: 598.
Format
Hardback
Publication date
1998
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
320
Condition
New
SKU
V9780471574811
ISBN
9780471574811
Hardback
Condition: New

€ 234.73

Paperback. Handbook for the computation and empirical estimation of reliability. Introduces an incomparable volume of easily applicable, cutting-edge results originated by prominent Russian reliability specialists. Completely covers probabilistic reliability, statistical reliability and optimization with simple, step-by-step, numerical examples. Editor(s): Ushakov, Igor A.; Harrison, Robert. Num Pages: 704 pages, black & white illustrations. BIC Classification: TGPR. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 239 x 166 x 41. Weight in Grams: 1120.
Format
Paperback
Publication date
1994
Publisher
John Wiley and Sons Ltd United States
Edition
Updated American Ed. /
Number of pages
704
Condition
New
SKU
V9780471571735
ISBN
9780471571735
Paperback
Condition: New

€ 239.78

Hardcover. Presents a rigorous development of thermodynamic laws of phase equilibria beginning with fundamental principles, accompanied by a short description of the mathematics vital to a clear understanding of basic concepts as well as the practical methods used to calculate phase equilibria. Series: Wiley Series in Chemical Engineering. Num Pages: 328 pages, Ill. BIC Classification: TC; TDC; TGMB. Category: (P) Professional & Vocational. Dimension: 244 x 166 x 23. Weight in Grams: 624.
Format
Hardback
Publication date
1992
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
328
Condition
New
SKU
V9780471571032
ISBN
9780471571032
Hardback
Condition: New

€ 130.99

Paperback. Offers an integrated account of the mathematical hypothesis of wave motion in liquids with a free surface, subjected to gravitational and other forces. Num Pages: 600 pages, bibliography, index. BIC Classification: PHDF; PHDS; RBKF; TGMF; TQS. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 157 x 232 x 40. Weight in Grams: 918.
Format
Paperback
Publication date
1992
Publisher
John Wiley & Sons Inc United States
Number of pages
600
Condition
New
SKU
V9780471570349
ISBN
9780471570349
Paperback
Condition: New

€ 205.60

Hardcover. Comprehensive and up-to-date, it covers the most vital part of software development, independent verification and validation. Presents a variety of methods that will ensure better quality, performance, cost and reliability of technical products and systems. Series: New Dimensions in Engineering Series. Num Pages: 384 pages, Illustrations. BIC Classification: KJMV5; TBC; TGP; UMZ. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 240 x 162 x 26. Weight in Grams: 688.
Format
Hardback
Publication date
1992
Publisher
John Wiley & Sons Inc United States
Edition
1st Edition
Number of pages
384
Condition
New
SKU
V9780471570110
ISBN
9780471570110
Hardback
Condition: New

€ 205.60

Paperback. This comprehensive reference presents the latest techniques for numerical analysis of forming operations. This is the perfect tool for those who wish to investigate new analytical methods for forming. Num Pages: 390 pages, Illustrations. BIC Classification: TBJ; TDM; TGMD. Category: (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 254 x 179 x 22. Weight in Grams: 710.
Format
Paperback
Publication date
1996
Publisher
John Wiley and Sons Ltd United States
Edition
1st Edition
Number of pages
390
Condition
New
SKU
V9780471570042
ISBN
9780471570042
Paperback
Condition: New

€ 291.68

Hardcover. Covers the basic principles of failure of metallic and non-metallic materials in mechanical design applications. Updated to include new developments on fracture mechanics, including both linear-elastic and elastic-plastic mechanics. Contains new material on strain and crack development and behavior. Num Pages: 672 pages, index. BIC Classification: TGMD5. Category: (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 233 x 157 x 55. Weight in Grams: 1260.
Format
Hardback
Publication date
1993
Publisher
John Wiley and Sons Ltd United States
Edition
2nd Edition
Number of pages
672
Condition
New
SKU
V9780471558910
ISBN
9780471558910
Hardback
Condition: New

€ 257.96

Hardcover. This revised handbook presents methods of analyzing industrial boiler and heat transfer equipment failure and offers suggestions to prevent future failures. It contains new material on fluid dynamics and the stress calculations that are required in boiler design. Num Pages: 528 pages, Ill. BIC Classification: TDM; TGBN1; TNKH. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 246 x 162 x 33. Weight in Grams: 847.
Format
Hardback
Publication date
1993
Publisher
John Wiley and Sons Ltd United States
Edition
2nd Edition
Number of pages
528
Condition
New
SKU
V9780471558392
ISBN
9780471558392
Hardback
Condition: New

€ 275.22

Hardcover. The classic introduction to engineering optimization theory and practice--now expanded and updated Engineering optimization helps engineers zero in on the most effective, efficient solutions to problems. This text provides a practical, real-world understanding of engineering optimization. Num Pages: 688 pages, Illustrations, map. BIC Classification: TBJ; TGPQ. Category: (P) Professional & Vocational. Dimension: 244 x 168 x 39. Weight in Grams: 1116.
Format
Hardback
Publication date
2006
Publisher
John Wiley and Sons Ltd United States
Edition
2nd Edition
Number of pages
688
Condition
New
SKU
V9780471558149
ISBN
9780471558149
Hardback
Condition: New

€ 190.43

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