Advanced Thermal Design of Electronic Equipment
Ralph Remsburg
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Description for Advanced Thermal Design of Electronic Equipment
Paperback. Num Pages: 589 pages, biography. BIC Classification: TGXT; THR; TJFC; UMB. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 32. Weight in Grams: 949.
The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many ... Read more
The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
589
Condition
New
Number of Pages
589
Place of Publication
New York, NY, United States
ISBN
9781461346333
SKU
V9781461346333
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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