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Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
Ju, Y. Sungtaek; Goodson, Kenneth E.
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Description for Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
Paperback. Series: Microsystems. Num Pages: 123 pages, biography. BIC Classification: PHD; TGM; THR. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 6. Weight in Grams: 207.
Advances in the semiconductor technology have enabled steady, exponential im- provement in the performance of integrated circuits. Miniaturization allows the integration of a larger number of transistors with enhanced switching speed. Novel transistor structures and passivation materials diminish circuit delay by minimizing parasitic electrical capacitance. These advances, however, pose several challenges for the thermal engineering of integrated circuits. The low thermal conductivities of passivation layers result in large temperature rises and temperature gradient magni- tudes, which degrade electrical characteristics of transistors and reduce lifetimes of interconnects. As dimensions of transistors and interconnects decrease, the result- ing changes in current density ... Read more
Advances in the semiconductor technology have enabled steady, exponential im- provement in the performance of integrated circuits. Miniaturization allows the integration of a larger number of transistors with enhanced switching speed. Novel transistor structures and passivation materials diminish circuit delay by minimizing parasitic electrical capacitance. These advances, however, pose several challenges for the thermal engineering of integrated circuits. The low thermal conductivities of passivation layers result in large temperature rises and temperature gradient magni- tudes, which degrade electrical characteristics of transistors and reduce lifetimes of interconnects. As dimensions of transistors and interconnects decrease, the result- ing changes in current density ... Read more
Product Details
Format
Paperback
Publication date
2012
Publisher
Springer-Verlag New York Inc. United States
Number of pages
123
Condition
New
Series
Microsystems
Number of Pages
102
Place of Publication
New York, NY, United States
ISBN
9781461373742
SKU
V9781461373742
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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