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Production engineering
Results 201 - 220 of 1328
Production engineering
Hardback. Offers a systematic exposition of the approach to stability analysis based on estimates for matrix-valued and operator-valued functions. This book helps us to investigate various classes of finite and infinite dimensional systems from a unified viewpoint. It is intended for specialists in stability theory. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 358 pages, biography. BIC Classification: TGP; TJFM. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 242 x 166 x 27. Weight in Grams: 680.
- Format
- Hardback
- Publication date
- 1998
- Publisher
- Kluwer Academic Publishers United States
- Number of pages
- 358
- Condition
- New
- SKU
- V9780792382218
- ISBN
- 9780792382218
Hardback
Condition: New
€ 201.44
€ 201.44
Spare Parts Inventory Control under System Availability Constraints (I...
Van Houtum, Geert-Jan, Kranenburg, Bram
Hardcover. Series: International Series in Operations Research & Management Science. Num Pages: 230 pages, 16 black & white illustrations, 7 colour illustrations, 45 black & white tables, biograph. BIC Classification: KJMV5; KJT; TBC; TGPR; TGXW. Category: (P) Professional & Vocational. Dimension: 165 x 244 x 14. Weight in Grams: 464.
- Format
- Hardback
- Publication date
- 2015
- Publisher
- Springer
- Edition
- 2015th Edition
- Condition
- New
- SKU
- V9781489976086
- ISBN
- 9781489976086
Hardback
Condition: New
€ 161.21
€ 161.21
Paperback. Series: Springer-Praxis Books. Num Pages: 430 pages, biography. BIC Classification: PBT; TGPR; TRC; TRP; TTDS. Category: (P) Professional & Vocational. Dimension: 244 x 170 x 23. Weight in Grams: 757.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 430
- Condition
- New
- SKU
- V9783642426230
- ISBN
- 9783642426230
Paperback
Condition: New
€ 339.73
€ 339.73
Hardback. Covers the manufacturing technology of solid freeform fabrication. This book describes the solid freeform fabrication techniques, and provides a historical perspective of its development. It is suitable for researchers in mechanical, chemical, electrical, and manufacturing engineering and materials and computer science. Num Pages: 330 pages, 104 black & white illustrations, biography. BIC Classification: TGPC; TTBL. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 20. Weight in Grams: 1450.
- Format
- Hardback
- Publication date
- 1996
- Publisher
- Kluwer Academic Publishers United States
- Number of pages
- 330
- Condition
- New
- SKU
- V9780792398349
- ISBN
- 9780792398349
Hardback
Condition: New
€ 200.74
€ 200.74
Hardcover. Using various examples throughout the text, this volume describes the potential of solid base catalysis. Readers will find an overview of solid base catalysis and the versatility of the reactions to which solid base catalysts can be utilized. Series: Springer Series in Chemical Physics. Num Pages: 434 pages, biography. BIC Classification: PHFC; PHV; PNRD; TGP. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 33. Weight in Grams: 812.
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
- Format
- Hardback
- Publication date
- 2011
- Edition
- 2011th Edition
- Condition
- New
- SKU
- V9783642183386
- ISBN
- 9783642183386
Hardback
Condition: New
€ 130.19
€ 130.19
Hardback. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Editor(s): Pecht, Michael. Num Pages: 312 pages, Ill. BIC Classification: TGP; TGX; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 242 x 159 x 20. Weight in Grams: 539.
- Format
- Hardback
- Publication date
- 1993
- Publisher
- John Wiley and Sons Ltd United States
- Number of pages
- 312
- Condition
- New
- SKU
- V9780471591672
- ISBN
- 9780471591672
Hardback
Condition: New
€ 178.93
€ 178.93
Paperback. Aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of current surface mount technology. Coverage includes basic technologies, application techniques, reliability and solutions to specific problems. Num Pages: 480 pages, 77 black & white illustrations, biography. BIC Classification: TGP; THRS; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 24. Weight in Grams: 703.
- Format
- Paperback
- Publication date
- 1992
- Publisher
- Kluwer Academic Publishers Group Netherlands
- Edition
- New ed
- Number of pages
- 480
- Condition
- New
- SKU
- V9780442013530
- ISBN
- 9780442013530
Paperback
Condition: New
€ 129.44
€ 129.44
Solder Joint Reliability Prediction for Multiple Environments
Perkins, Andrew Eugene; Sitaraman, Suresh K.
Paperback. Here is a text that will provide industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. Num Pages: 192 pages, 70 black & white illustrations, 37 black & white tables, biography. BIC Classification: TGM; TGPQ; TJFD. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 11. Weight in Grams: 326.
- Format
- Paperback
- Publication date
- 2010
- Publisher
- Springer-Verlag New York Inc. United States
- Edition
- 1st ed. Softcover of orig. ed. 2009
- Number of pages
- 192
- Condition
- New
- SKU
- V9781441946348
- ISBN
- 9781441946348
Paperback
Condition: New
€ 138.78
€ 138.78
Hardcover. This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more. Series: Advanced Structured Materials. Num Pages: 187 pages, 64 black & white illustrations, 55 colour illustrations, biography. BIC Classification: TGMT; TGPR. Category: (P) Professional & Vocational. Dimension: 244 x 160 x 15. Weight in Grams: 426.
- Format
- Hardback
- Publication date
- 2014
- Publisher
- Springer International Publishing AG Switzerland
- Edition
- 2014th Edition
- Number of pages
- 350
- Condition
- New
- SKU
- V9783319000916
- ISBN
- 9783319000916
Hardback
Condition: New
€ 127.42
€ 127.42
Paperback. This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more. Series: Advanced Structured Materials. Num Pages: 187 pages, 64 black & white illustrations, 55 colour illustrations, biography. BIC Classification: TGMT; TGPR. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 10. Weight in Grams: 297.
- Format
- Paperback
- Publication date
- 2016
- Publisher
- Springer International Publishing AG Switzerland
- Edition
- Softcover reprint of the original 1st ed. 2014
- Number of pages
- 187
- Condition
- New
- SKU
- V9783319343013
- ISBN
- 9783319343013
Paperback
Condition: New
€ 126.53
€ 126.53
Paperback. Series: Practitioners. Num Pages: 520 pages, black & white illustrations. BIC Classification: TGPQ; UF; UMZ. Category: (P) Professional & Vocational. Dimension: 253 x 180 x 29. Weight in Grams: 924.
- Format
- Paperback
- Publication date
- 2000
- Publisher
- IEEE Computer Society Press,U.S. United States
- Edition
- 1st Edition
- Number of pages
- 520
- Condition
- New
- SKU
- V9780769502991
- ISBN
- 9780769502991
Paperback
Condition: New
€ 140.70
€ 140.70
Hardback. Software Reliability Assessment with OR Applications provides a comprehensive guide to software reliability measurement, prediction, and control. Readers will find solutions to decision-making problems that software developers and engineers often face. Series: Springer Series in Reliability Engineering. Num Pages: 572 pages, 68 black & white tables, biography. BIC Classification: KJMV5; TGPQ; UMZ; UYAM; UYD. Category: (P) Professional & Vocational. Dimension: 244 x 169 x 35. Weight in Grams: 960.
- Format
- Hardback
- Publication date
- 2011
- Publisher
- Springer London Ltd United Kingdom
- Number of pages
- 572
- Condition
- New
- SKU
- V9780857292032
- ISBN
- 9780857292032
Hardback
Condition: New
€ 253.15
€ 253.15
Paperback. This book presents a state-of-the-art quality model for continuous software quality control. It illustrates the application of techniques and methodologies using numerous real-world examples. Num Pages: 222 pages, biography. BIC Classification: TGPR; UMZ; UYZM. Category: (G) General (US: Trade). Dimension: 235 x 155 x 12. Weight in Grams: 349.
- Format
- Paperback
- Publication date
- 2014
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Edition
- Softcover reprint of the original 1st ed. 2013
- Number of pages
- 222
- Condition
- New
- SKU
- V9783642441905
- ISBN
- 9783642441905
Paperback
Condition: New
€ 67.09
€ 67.09
Hardback. Software Product Quality Control Num Pages: 210 pages, biography. BIC Classification: TGPR; UMZ; UYZM. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 18. Weight in Grams: 502.
- Format
- Hardback
- Publication date
- 2013
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 210
- Condition
- New
- SKU
- V9783642385704
- ISBN
- 9783642385704
Hardback
Condition: New
€ 66.97
€ 66.97
Hardback. Software has become a decisive cost and time factor in regard to developing and establishing manufacturing systems. This text discusses ways to reduce costs and raise quality in the development of control software. It describes new methods for the solution of control software problems. Editor(s): Storr, Alfred; Jarvis, D.H. Series: IFIP Advances in Information and Communication Technology. Num Pages: 206 pages, biography. BIC Classification: TGPC; UGC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 12. Weight in Grams: 1050.
- Format
- Hardback
- Publication date
- 1996
- Publisher
- Chapman and Hall United Kingdom
- Number of pages
- 206
- Condition
- New
- SKU
- V9780412784606
- ISBN
- 9780412784606
Hardback
Condition: New
€ 253.37
€ 253.37
Paperback. The 14th online World Conference on Soft Computing in Industrial Applications provides a unique opportunity for soft computing researchers and practitioners to publish high quality papers and discuss research issues in detail without incurring a huge cost. Editor(s): Gao, X.Z.; Gaspar-Cunha, Antonio; Koppen, Mario; Wang, Jun; Schaefer, Gerald. Series: Advances in Intelligent and Soft Computing (Closed). Num Pages: 300 pages, 39 colour illustrations, biography. BIC Classification: PBW; TBC; TGP; UYQ. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 583.
- Format
- Paperback
- Publication date
- 2010
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 300
- Condition
- New
- SKU
- V9783642112812
- ISBN
- 9783642112812
Paperback
Condition: New
€ 250.17
€ 250.17
Hardback. Editor(s): Muthu, Subramanian Senthilkannan. Num Pages: 261 pages, 20 black & white illustrations, biography. BIC Classification: KJMV5; TGP. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 16. Weight in Grams: 561.
- Format
- Hardback
- Publication date
- 2015
- Publisher
- Springer Verlag, Singapore Singapore
- Number of pages
- 261
- Condition
- New
- SKU
- V9789812872951
- ISBN
- 9789812872951
Hardback
Condition: New
€ 128.39
€ 128.39
Paperback. Editor(s): Muthu, Subramanian Senthilkannan. Series: Environmental Footprints and Eco-Design of Products and Processes. Num Pages: 261 pages, 20 black & white illustrations, biography. BIC Classification: KCP; KJMV; RNF; RNU; TGP. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 14. Weight in Grams: 409.
- Format
- Paperback
- Publication date
- 2016
- Publisher
- Springer Verlag, Singapore Singapore
- Edition
- Softcover reprint of the original 1st ed. 2015
- Number of pages
- 261
- Condition
- New
- SKU
- V9789811013645
- ISBN
- 9789811013645
Paperback
Condition: New
€ 138.31
€ 138.31
hardcover. Smart technologies comprise a dynamic new interdisciplinary research field that encompasses a wide spectrum of engineering applications including, but not limited to, intelligent structures and materials, actuators, sensors and structural observability, control systems and software tools for the design of adaptive structures. Editor(s): Holnicki-Szulc, Jan. Num Pages: 350 pages, Illustrations. BIC Classification: KNXC; TGPR; UY. Category: (P) Professional & Vocational. Dimension: 250 x 173 x 26. Weight in Grams: 748.
- Format
- Hardback
- Publication date
- 2008
- Publisher
- Wiley United Kingdom
- Edition
- 1st Edition
- Number of pages
- 350
- Condition
- New
- SKU
- V9780470058466
- ISBN
- 9780470058466
Hardback
Condition: New
€ 161.09
€ 161.09
Hardback. Num Pages: 308 pages, black & white illustrations, bibliography. BIC Classification: KFFN; TGPQ; UNF; UYQV. Category: (G) General (US: Trade). Dimension: 244 x 170 x 19. Weight in Grams: 721.
- Format
- Hardback
- Publication date
- 2014
- Publisher
- Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
- Number of pages
- 308
- Condition
- New
- SKU
- V9783642552502
- ISBN
- 9783642552502
Hardback
Condition: New
€ 74.27
€ 74.27