.png){kind=logo}
Stock image for illustration purposes only - book cover, edition or condition may vary.
Solder Joint Reliability Assessment
Tamin, Mohd Nasir; Shaffiar, Norhashimah M.
€ 127.42
FREE Delivery in Ireland
Description for Solder Joint Reliability Assessment
Hardcover. This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more. Series: Advanced Structured Materials. Num Pages: 187 pages, 64 black & white illustrations, 55 colour illustrations, biography. BIC Classification: TGMT; TGPR. Category: (P) Professional & Vocational. Dimension: 244 x 160 x 15. Weight in Grams: 426.
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface ... Read more
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface ... Read more
Product Details
Format
Hardback
Publication date
2014
Publisher
Springer International Publishing AG Switzerland
Number of pages
350
Condition
New
Series
Advanced Structured Materials
Number of Pages
174
Place of Publication
Cham, Switzerland
ISBN
9783319000916
SKU
V9783319000916
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Solder Joint Reliability Assessment