Thermal Contact Conductance
Chakravarti V. Madhusudana
€ 149.47
FREE Delivery in Ireland
Description for Thermal Contact Conductance
Paperback. This book covers both theoretical and practical aspects of thermal contact conductance. It includes numerous new heat transfer applications and describes a generalized approach for determining solid spot conductance. Series: Mechanical Engineering Series. Num Pages: 278 pages, 116 black & white illustrations, 17 colour illustrations, 42 colour tables, biography. BIC Classification: TGMB. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 15. Weight in Grams: 433.
The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.
The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.
Product Details
Format
Paperback
Publication date
2016
Publisher
Springer International Publishing AG Switzerland
Number of pages
278
Condition
New
Series
Mechanical Engineering Series
Number of Pages
260
Place of Publication
Cham, Switzerland
ISBN
9783319374284
SKU
V9783319374284
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
About Chakravarti V. Madhusudana
Professor Madhusudana is currently working out of Sudney, Australia
Reviews for Thermal Contact Conductance
Reviewer 1: The composition of the book follows a classic outline. It includes comprehensive theoretical insight into the phenomenon of TCC which establishes the links between the main physical characteristics determining TCC (properties of materials, surfaces and interstitial media), in the form of non-dimensional correlations. This allows the author to present TCC for variety of different materials in a ... Read more