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Wafer Bonding
Ulrich . Ed(S): Gosele
€ 428.60
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Description for Wafer Bonding
Paperback. Editor(s): Gosele, Ulrich. Series: Springer Series in Materials Science. Num Pages: 519 pages, 363 black & white illustrations, 20 colour illustrations, biography. BIC Classification: PHFC; TDCK; TGMT; TJFD. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 27. Weight in Grams: 795.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Product Details
Format
Paperback
Publication date
2011
Publisher
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Germany
Number of pages
519
Condition
New
Series
Springer Series in Materials Science
Number of Pages
504
Place of Publication
Berlin, Germany
ISBN
9783642059155
SKU
V9783642059155
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Wafer Bonding
From the reviews: "Wafer bonding, also known as direct wafer bonding or wafer fusion, has developed from an almost obscure niche technology in the 1980s … . Anyone interested in learning about the basics of wafer bonding and its various application areas, will likely be served by this outstanding volume while the researcher engaged in ... Read more