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Wafer-Level Chip-Scale Packaging
Qu, Shichun; Liu, Yong
€ 195.46
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Description for Wafer-Level Chip-Scale Packaging
Hardback. Num Pages: 339 pages, 58 black & white illustrations, 256 colour illustrations, 58 black & white tables, biogra. BIC Classification: TGMB; TJF; TJFC. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 21. Weight in Grams: 706.
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from ... Read more
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from ... Read more
Product Details
Format
Hardback
Publication date
2014
Publisher
Springer-Verlag New York Inc. United States
Number of pages
339
Condition
New
Number of Pages
322
Place of Publication
New York, United States
ISBN
9781493915552
SKU
V9781493915552
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Wafer-Level Chip-Scale Packaging
“Wafer Level Chip-Scale Packaging by Qu, Shichun, Liu, Yong presents good technical insights of wafer-level chip scale packaging (WLCSP) technology, suitable for both industry and academic practitioners. … It is a good reference to demonstrate the alternate wafer-level chip scale packaging, and can serve as a very informative technical reference. … The book is valuable as a learning tool for ... Read more