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Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging (Pt. 1)
R. R. Tummala
€ 434.92
FREE Delivery in Ireland
Description for Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging (Pt. 1)
Hardcover. Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Num Pages: 1030 pages, biography. BIC Classification: TJFD5; UM. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 55. Weight in Grams: 1742.
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. ... Read more
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. ... Read more
Product Details
Publisher
Springer
Format
Hardback
Publication date
1997
Condition
New
Weight
1742g
Number of Pages
1030
Place of Publication
London, United Kingdom
ISBN
9780412084416
SKU
V9780412084416
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
Reviews for Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging (Pt. 1)
`A most comprehensive book set, both well presented and well illustrated.' IEEE Electrical Insulation Magazine, September/October 1997