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Microscale Heat Transfer, Fundamentals and Applications
. Ed(S): Kakac, Sadik; Vasiliev, L.L.; Bayazitoglu, Yildiz (Rice University); Yener, Yaman
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Description for Microscale Heat Transfer, Fundamentals and Applications
Paperback. Provides a comprehensive assessment of the fundamentals of the Microscale heat transfer and transport phenomena and heat transfer and applications in Microsystems. Devices having dimensions of order of microns are being developed for use of cooling of integrated circuits, and in biochemicals-biomedical applications and cryogenics. Editor(s): Kakac, Sadik; Vasiliev, L.L.; Bayazitoglu, Yildiz (Rice University); Yener, Yaman. Series: NATO Science Series II. Num Pages: 509 pages, biography. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 26. Weight in Grams: 722.
This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic ... Read more
This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic ... Read more
Product Details
Format
Paperback
Publication date
2005
Publisher
Springer-Verlag New York Inc. United States
Number of pages
509
Condition
New
Series
NATO Science Series II
Number of Pages
509
Place of Publication
New York, NY, United States
ISBN
9781402033605
SKU
V9781402033605
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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